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"lin hsiu jen"的相关文件
显示项目 11-15 / 15 (共1页)
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| 國立臺灣大學 |
2007 |
Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Chi, Chih-Chien |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
显示项目 11-15 / 15 (共1页)
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