臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2009-03	Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique	Chiu, Tz-Cheng; Lin, Huang-Chun
國立成功大學	2008-07-17	應用虛擬裂紋閉合法於三維界面裂紋問題	林煌鈞; Lin, Huang-Chun
國立成功大學	2008-07-17	應用虛擬裂紋閉合法於三維界面裂紋問題	林煌鈞; Lin, Huang-Chun
國立成功大學	2008-06	On the homogenization of multilayered interconnect for interfacial fracture analysis	Chiu, Tz-Cheng; Lin, Huang-Chun

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