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"lin jim wein"的相关文件
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| 國立交通大學 |
2020-07-01T05:21:48Z |
Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging
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Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Lin, Jim-Wein; Lin, Puru; Ko, Cheng-Ta; Chen, Yu-Hua; Shen, Wen-Wei; Kou, Tzu-Ying; Huang, Shin-Yi; Lin, Ang-Ying; Lin, Yu-Min; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package
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Ko, Cheng-Ta; Yang, Kai-Ming; Lin, Jim-Wein; Wang, Chih-Lun; Chou, Tzu-Chieh; Yang, Yu-Tao; Yu, Ting-Yang; Chen, Yu-Hua; Chen, Kuan-Neng; Tseng, Tzyy-Jang |
| 國立交通大學 |
2014-12-08T15:28:01Z |
Highly efficient femtosecond pulse stretching by tailoring cavity dispersion in erbium fiber lasers with an intracavity short-pass edge filter
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Chen, Nan-Kuang; Liu, Feng-Zhou; Chuang, Hsiu-Po; Lai, Yinchieh; Yang, Shang-Da; Lin, Jim-Wein; Liaw, Shien-Kuei; Chang, Yu-Chung; Huang, Chen-Bin; Chi, Sien |
| 國立彰化師範大學 |
2011-08 |
Highly efficient femtosecond pulse stretching by tailoring cavity dispersion in erbium fiber lasers with an intracavity short-pass edge filter
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Chen, Nan-Kuang ; Liu, Feng-Zhou ; Chuang, Hsiu-Po ; Lai, Yinchieh ; Yang, Shang-Da ; Lin, Jim-Wein ; Liaw, Shien-Kuei ; Chang, Yu-Chung; Huang, Chen-Bin; Chi, Sien |
显示项目 1-4 / 4 (共1页)
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