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Showing items 71-80 of 182 (19 Page(s) Totally)
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| 國立成功大學 |
2020 |
Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
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Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, G.-T.;Lin, K.-L. |
| 國立成功大學 |
2020 |
A light-weight CAAD-VR bridge
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Chien, S.-F.;Lin, C.-I.;Lin, K.-L. |
| 國立成功大學 |
2020 |
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
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Liang, C.-L.;Lin, Y.-S.;Kao, C.-L.;Tarng, D.;Wang, S.-B.;Hung, Y.-C.;Lin, K.-L. |
| 國立成功大學 |
2020 |
3D integration of vertical-stacking of MoS2and Si CMOS featuring embedded 2T1R configuration demonstrated on full wafers
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Su, C.J.;Huang, M.K.;Lee, K.S.;Hu, V.P.H.;Huang, Y.F.;Zheng, B.C.;Yao, C.H.;Lin, N.C.;Kao, Kao K.H.;Hong, T.C.;Sung, P.J.;Wu, C.T.;Yu, T.Y.;Lin, K.L.;Tseng, Y.C.;Lin, C.L.;Lee, Y.J.;Chao, T.S.;Li, J.Y.;Wu, Wu W.F.;Shieh, J.M.;Wang, Y.H.;Yeh, W.K. |
| 臺大學術典藏 |
2019-11-29T03:04:26Z |
Transcranial ultrasound diagnosis of intracranial lesions in children with headaches
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Wang H.-S.;Meng-Fai Kuo;Huang S.-C.;Chou M.-L.;Hung P.-C.;Lin K.-L.; Wang H.-S.; MENG-FAI KUO; Huang S.-C.; Chou M.-L.; Hung P.-C.; Lin K.-L. |
| 臺大學術典藏 |
2019-11-29T03:04:22Z |
Pyridoxal phosphate is better than pyridoxine for controlling idiopathic intractable epilepsy
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Wang H.-S.;Meng-Fai Kuo;Chou M.-L.;Hung P.-C.;Lin K.-L.;Hsieh M.-Y.;Chang M.-Y.; Wang H.-S.; MENG-FAI KUO; Chou M.-L.; Hung P.-C.; Lin K.-L.; Hsieh M.-Y.; Chang M.-Y. |
| 國立交通大學 |
2019-04-02T06:04:37Z |
Voltage Transfer Characteristic Matching by Different Nanosheet Layer Numbers of Vertically Stacked Junctionless CMOS Inverter for SoP/3D-ICs applications
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Sung, P. -J.; Chang, C. -Y.; Chen, L. -Y.; Kao, K. -H.; Su, C. -J.; Liao, T. -H.; Fang, C. -C.; Wang, C. -J.; Hong, T. -C.; Jao, C. -Y.; Hsu, H. -S.; Luo, S. -X.; Wang, Y. -S.; Huang, H. -F.; Li, J. -H.; Huang, Y. -C.; Hsueh, F. -K.; Wu, C. -T.; Huang, Y. -M.; Hou, F. -J.; Luo, G. -L.; Shen, Y. -L.; Ma, W. C. -Y.; Huang, K. -P.; Lin, K. -L.; Samukawa, S.; Li, Y.; Huang, G. -W; Lee, Y. -J.; Li, J. -Y.; Wu, W. -F.; Shieh, J. -M.; Chao, T. -S.; Yeh, W. -K.; Wang, Y. -H. |
| 國立交通大學 |
2019-04-02T05:57:57Z |
The influences of surface treatment and gas annealing conditions on the inversion behaviors of the atomic-layer-deposition Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitor
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Trinh, H. D.; Chang, E. Y.; Wu, P. W.; Wong, Y. Y.; Chang, C. T.; Hsieh, Y. F.; Yu, C. C.; Nguyen, H. Q.; Lin, Y. C.; Lin, K. L.; Hudait, M. K. |
| 國立成功大學 |
2019 |
The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders
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Guo, W.-T.;Liang, C.-L.;Lin, K.-L. |
| 國立成功大學 |
2019 |
Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys
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Sarwono, D.;Lin, K.-L. |
Showing items 71-80 of 182 (19 Page(s) Totally)
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