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Showing items 86-95 of 182  (19 Page(s) Totally)
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Institution Date Title Author
國立交通大學 2018-08-21T05:56:59Z Ge Nanowire FETs with HfZrOx Ferroelectric Gate Stack Exhibiting SS of Sub-60 mV/dec and Biasing Effects on Ferroelectric Reliability Su, C. -J.; Hong, T. -C.; Tsou, Y. -C.; Hou, F. -J.; Sung, P. -J.; Yeh, M. -S.; Wan, C. -C.; Kao, K. -H.; Tang, Y. -T.; Chiu, C. -H.; Wang, C. -J.; Chung, S. -T.; You, T. -Y.; Huang, Y. -C.; Wu, C. -T.; Lin, K. -L.; Luo, G. -L.; Huang, K. -P.; Lee, Y. -J.; Chao, T. -S.; Wu, W. -F.; Huang, G. -W.; Shieh, J. -M.; Yeh, W. -K.; Wang, Y. -H.
國立交通大學 2018-08-21T05:56:34Z Full Low Temperature Microwave Processed Ge CMOS Achieving Diffusion-Less Junction and Ultrathin 7.5nm Ni Mono-Germanide Lee, Y. -J.; Chuang, S. -S.; Liu, C. -I.; Hsueh, F. -K.; Sung, P. -J.; Chen, H. -C.; Wu, C. -T.; Lin, K. -L.; Yao, J. -Y.; Shen, Y. -L.; Kuo, M. -L.; Yang, C. -H.; Luo, G. -L.; Chen, H. -W.; Lai, C. -H.; Current, M. I.; Wu, C. -Y.; Wan, Y. -M.; Tseng, T. -Y.; Hu, Chenming; Yang, F. -L.
國立臺灣科技大學 2018 Effect of residual rice husk ash on mechanical-microstructural properties and thermal conductivity of sodium-hydroxide-activated bricks Huynh T.-P.; Hwang C.-L.; Lin K.-L.; Ngo S.-H.
國立臺灣科技大學 2018 Influence of high heat load on flow and containment of an inclined air-curtain (IAC) fume hood Huang R.F.; Hsu C.M.; Lin K.L.
國立臺灣科技大學 2018 Elucidating the effects of nanosilica on the characteristics of alkali-activated thin-film transistor liquid-crystal display waste glass Gao K.; Lin K.-L.; Hwang C.-L.; Tuan B.L.A.; Cheng T.-W.; Wang D.
國立臺灣科技大學 2018 Utilization of reduction slag and waste sludge for Portland cement clinker production Lin K.-L.; Lo K.-W.; Hung M.-J.; Hwang C.-L.; Cheng T.-W.; Chang Y.-M.
國立臺灣科技大學 2018 PlanarONoC: Concurrent placement and routing considering crossing minimization for optical networks-on-chip Chuang Y.-K.; Chen K.-J.; Lin K.-L.; Fang S.-Y.; Li B.; Schlichtmann U.
臺大學術典藏 2018 Key-frame Selection for Multi-robot Simultaneous Localization and Tracking in Robot Soccer Field CHI-SHENG SHIH; Shih, C.-S.; Lin, K.-L.; Fu, W.-K.
國立成功大學 2018 The interfacial bilayer Cu6Sn5 formed in a Sn–Ag–Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging Liang, C.-L.;Lin, K.-L.;Cheng, P.-J.
國立成功大學 2018 Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study Mittal, J.;Lin, K.-L.

Showing items 86-95 of 182  (19 Page(s) Totally)
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