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"lin kc"
Showing items 21-30 of 114 (12 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:42:27Z |
Effect of pulse frequency on leveling and resistivity of copper coatings
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Chen, CF; Lin, KC |
| 國立交通大學 |
2014-12-08T15:42:14Z |
Wetting effect on gap filling submicron damascene by an electrolyte free of levelers
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Chang, SC; Shieh, JM; Lin, KC; Dai, BT; Wang, TC; Chen, CF; Feng, MS; Li, YH; Lu, CP |
| 國立交通大學 |
2014-12-08T15:41:49Z |
Leveling effects of copper electrolytes with hybrid-mode additives
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Lin, KC; Shieh, JM; Chang, SC; Dai, BT; Chen, CF; Feng, MS; Li, YH |
| 國立交通大學 |
2014-12-08T15:40:08Z |
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
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Shao, TL; Lin, KC; Chen, C |
| 國立交通大學 |
2014-12-08T15:39:40Z |
Effects of gamma radiation on optical fibre sensors
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Lin, KC; Lin, CJ; Lee, WY |
| 國立交通大學 |
2014-12-08T15:39:18Z |
Ballistic transport through coupled T-shaped quantum wires
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Lin, YK; Lin, KC; Chuu, DS |
| 國立交通大學 |
2014-12-08T15:36:20Z |
Improved field-emission properties of carbon nanotube field-emission arrays by controlled density growth,of carbon nanotubes
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Juan, CP; Chen, KJ; Tsai, CC; Lin, KC; Hong, WK; Hsieh, CY; Wang, WP; Lai, RL; Chen, KH; Chen, LC; Cheng, HC |
| 國立交通大學 |
2014-12-08T15:27:51Z |
REACTIVE ION ETCH OF GAAS AND ALGAAS USING BCL3, SICL4 AND SF6, INSTEAD OF CCL2F2
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WU, JW; CHANG, CY; LIN, KC; CHANG, EY; HWANG, JH |
| 國立交通大學 |
2014-12-08T15:27:49Z |
THE RELIABILITY OF MULTILEVEL METALLIZATION ON INGAAS/GAAS LAYERS
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CHANG, EY; CHEN, JS; WU, JW; LIN, KC |
| 國立交通大學 |
2014-12-08T15:27:49Z |
THE SELECTIVITY OF REACTIVE ION ETCH OF GA0.51IN0.49P/GAAS
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WU, JW; CHAN, SH; LIN, KC; CHANG, CY; CHANG, EY |
Showing items 21-30 of 114 (12 Page(s) Totally)
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