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"lin kwang lung"
Showing items 41-50 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2009-06 |
The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
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Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-02-05 |
Microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment
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Hsuan, Teng-Chun; Lin, Kwang-Lung |
| 國立成功大學 |
2009-02 |
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry
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Wu, Y. K.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2009-01 |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
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Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2009 |
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
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Yeh, T. K.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2008-10 |
Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2008-09 |
Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution
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Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2008-08-11 |
The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate
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Pan, Chien-Cheng; Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
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Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2008-05-29 |
Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging
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Liu, Nai-Shuo; Lin, Kwang-Lung |
Showing items 41-50 of 130 (13 Page(s) Totally)
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