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"lin kwang lung"
Showing items 71-80 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2006-02-06 |
The atomic-scale studies of the behavior of the crystal dissolution in a molten metal
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Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2006-01 |
The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu
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Liu, Nai-Shuo; Lin, Kwang-Lung |
| 東方設計學院 |
2006 |
Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy
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陳剛毅; Chen, Kang-I; 鄭壽昌; Cheng, Shou-Chang; 吳信賢; Wu, Sean; Lin, Kwang-Lung; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2006 |
Potentiodynamic polarization measurement of Sn-8.5Zn-XAl-0.5Ga alloy in 3.5% NaCl solution
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Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-10-15 |
Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution
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Mohanty, Udit-Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-10 |
Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2005-09 |
Role of ag in the formation of interfacial intermetallic phases in Sn-Zn soldering
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Song, Jenn-Ming; Liu, Pei-Chi; Shih, Chia-Ling; Lin, Kwang-Lung |
| 國立成功大學 |
2005-08 |
Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration
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Liu, Yeh-Hsiu; Lin, Kwang-Lung |
| 國立成功大學 |
2005-06-15 |
Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution
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Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2005-05 |
Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate
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Yu, Chang-Ho; Lin, Kwang-Lung |
Showing items 71-80 of 130 (13 Page(s) Totally)
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