| 國立成功大學 |
2004-03 |
Microstructures, thermal and tensile properties of Sn-Zn-Ga alloys
|
Song, Jenn-Ming; Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2004-02 |
Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2004-01 |
The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
|
Chuang, Chiang-Ming; Hung, Hui-Tzu; Liu, Pei-Chi; Lin, Kwang-Lung |
| 國立成功大學 |
2003-12 |
A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder
|
Lin, Kwang-Lung; Chen, Kang-I; Shi, Po-Cheng |
| 國立成功大學 |
2003-12 |
Microstructure and thermal behavior of Sn-Zn-Ag solders
|
Lin, Kwang-Lung; Shih, Chia-Ling |
| 國立成功大學 |
2003-12 |
Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword
|
Lucas, James P.; Chada, Srini; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Ready, Jud; Yu, Jin |
| 國立成功大學 |
2003-12 |
Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
|
Chuang, Chiang-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2003-11-15 |
Preparation of Cu1-xTax films and the material interaction in the Si/Cu1-xTax/Cu structure
|
Lin, Chien-Tai; Lin, Kwang-Lung |
| 國立成功大學 |
2003-10 |
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag
|
Chen, Kang-I; Lin, Kwang-Lung |
| 國立成功大學 |
2003-10 |
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga
|
Chen, Kang-I; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
|
Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Electrodeposition of eutectic Sn-Zn alloy by pulse plating
|
Lin, Kwang-Lung; Sun, Li-Min |
| 國立成功大學 |
2003-09 |
The Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al
|
Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P
|
Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2003-08-01 |
The cathode current efficiency of flip-chip solder bump plating
|
Lin, Kwang-Lung; Liu, Yeh-Hsiu |
| 國立成功大學 |
2003-08 |
Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
| 國立成功大學 |
2003-07 |
Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2003-05-31 |
Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating
|
Lin, Chien-Tai; Lin, Kwang-Lung |
| 東方設計學院 |
2003-05-27 |
Improvement in the Properties of Sn-Zn Eutectic Based Pb-free Solder
|
Lin, Kwang-Lung; 陳剛毅; Chen, Kang-I; Hsu, Hui-Min; Shi, Chia-Ling; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2003-05 |
Structural evolution of electroless nickel bump
|
Lin, Kwang-Lung; Wu, Chih-Hau |
| 國立成功大學 |
2003-02 |
Wetting interaction between Sn-Zn-Ag solders and Cu
|
Lin, Kwang-Lung; Shih, Chia-Ling |
| 國立成功大學 |
2003-01 |
Mechanical strength of Sn-3.5Ag-based solders and related bondings
|
Chuang, Chiang-Ming; Shih, Po-Cheng; Lin, Kwang-Lung |
| 東方設計學院 |
2002-12-03 |
Effects of Gallium on Wettability, Microstructures and mechanical Properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga Solder Alloys
|
陳剛毅; Chen, Kang-I; Lin, Kwang-Lung; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2002-11 |
Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder
|
Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2002-09 |
The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
