| 國立成功大學 |
2016-12 |
Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu
|
Huang, Wei-Chih; Lin, Kwang-Lung |
| 國立成功大學 |
2016-12 |
The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire
|
Huang, Wei-Hsiang; Lin, Kwang-Lung; Lin, Yu-Wei; Cheng, Yun-Kai |
| 國立成功大學 |
2016-11-20 |
The microstructure and mechanical properties of Zn-25Sn-XAl (X=0-0.09 wt%) high temperature lead free solder
|
Niu, Xi; Lin, Kwang-Lung |
| 國立成功大學 |
2016-03-21 |
Disruption of crystalline structure of Sn3.5Ag induced by electric current
|
Huang, Han-Chie; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2016-03 |
The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing
|
Hsiao, Yu-Hsiang; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing
|
Wang, Ting-Hui; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent
|
Frischa, M. W.; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
|
Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-12-01 |
High dislocation density of tin induced by electric current
|
Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-10-15 |
Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient
|
Niu, Xi; Lin, Kwang-Lung |
| 國立成功大學 |
2015-03-17 |
Microstructural Evolution of the Intermetallic Compounds in the TCNCP Solder Joint During Pre-con and TCT Tests
|
Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-03 |
Synthesis and characterization of Sn coating on MWCNT using DBA as capping agent
|
Wachid, Frischa Marcheliana; Lin, Kwang-Lung |
| 國立成功大學 |
2015-01-15 |
The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing
|
He, Jian-Yang; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2014-12 |
Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder
|
Liu, Chin-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
|
Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-08 |
Connecting Carbon Nanotubes Using Sn
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2013-04 |
Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2013-03 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
| 國立成功大學 |
2013-01 |
Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow
|
Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2012-12 |
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
|
Hsiao, Yu-Hsiang; Lin, Kwang-Lung; Lee, Chiu-Wen; Shao, Yu-Hsiu; Lai, Yi-Shao |
| 國立成功大學 |
2012-12 |
Effect of Ga on the Oxidation Properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa Solders
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2012-10 |
The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process
|
Lin, Kwang-Lung; Lin, Yu-Wei; Yu, Chang-Ho |
| 國立成功大學 |
2012-09 |
Electrochemical Corrosion Behaviour of Lead-Free Solder Alloys in 3.5% Nacl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
