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總筆數 :2856704
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53806031
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2363
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"lin kwang lung"的相關文件
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| 國立成功大學 |
2016-01 |
The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing
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Wang, Ting-Hui; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent
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Frischa, M. W.; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
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Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-12-01 |
High dislocation density of tin induced by electric current
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Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-10-15 |
Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient
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Niu, Xi; Lin, Kwang-Lung |
| 國立成功大學 |
2015-03-17 |
Microstructural Evolution of the Intermetallic Compounds in the TCNCP Solder Joint During Pre-con and TCT Tests
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Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-03 |
Synthesis and characterization of Sn coating on MWCNT using DBA as capping agent
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Wachid, Frischa Marcheliana; Lin, Kwang-Lung |
| 國立成功大學 |
2015-01-15 |
The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing
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He, Jian-Yang; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2014-12 |
Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder
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Liu, Chin-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
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