| 國立成功大學 |
2016-12 |
Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu
|
Huang, Wei-Chih; Lin, Kwang-Lung |
| 國立成功大學 |
2016-12 |
The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire
|
Huang, Wei-Hsiang; Lin, Kwang-Lung; Lin, Yu-Wei; Cheng, Yun-Kai |
| 國立成功大學 |
2016-11-20 |
The microstructure and mechanical properties of Zn-25Sn-XAl (X=0-0.09 wt%) high temperature lead free solder
|
Niu, Xi; Lin, Kwang-Lung |
| 國立成功大學 |
2016-03-21 |
Disruption of crystalline structure of Sn3.5Ag induced by electric current
|
Huang, Han-Chie; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2016-03 |
The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing
|
Hsiao, Yu-Hsiang; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
The Dissolution and Supersaturation of Zn in the Sn9Zn Solder Under Current Stressing
|
Wang, Ting-Hui; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent
|
Frischa, M. W.; Lin, Kwang-Lung |
| 國立成功大學 |
2016-01 |
Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints
|
Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-12-01 |
High dislocation density of tin induced by electric current
|
Liao, Yi-Han; Liang, Chien-Lung; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2015-10-15 |
Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient
|
Niu, Xi; Lin, Kwang-Lung |
| 國立成功大學 |
2015-03-17 |
Microstructural Evolution of the Intermetallic Compounds in the TCNCP Solder Joint During Pre-con and TCT Tests
|
Liang, Chien-Lung; Lin, Kwang-Lung; Peng, Jr-Wei |
| 國立成功大學 |
2015-03 |
Synthesis and characterization of Sn coating on MWCNT using DBA as capping agent
|
Wachid, Frischa Marcheliana; Lin, Kwang-Lung |
| 國立成功大學 |
2015-01-15 |
The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing
|
He, Jian-Yang; Lin, Kwang-Lung; Wu, Albert T. |
| 國立成功大學 |
2014-12 |
Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder
|
Liu, Chin-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
|
Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-08 |
Connecting Carbon Nanotubes Using Sn
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2013-04 |
Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu-XNi Solder Alloys in 3.5% NaCl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2013-03 |
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lee, Hsin-Yi |
| 國立成功大學 |
2013-02-05 |
Electrorecrystallization of Metal Alloy
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Wu, Albert T.; Jang, Wei-Luen; Dong, Chung-Li; Lai, Yi-Shao |
| 國立成功大學 |
2013-01 |
Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow
|
Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2012-12 |
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
|
Hsiao, Yu-Hsiang; Lin, Kwang-Lung; Lee, Chiu-Wen; Shao, Yu-Hsiu; Lai, Yi-Shao |
| 國立成功大學 |
2012-12 |
Effect of Ga on the Oxidation Properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa Solders
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2012-10 |
The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process
|
Lin, Kwang-Lung; Lin, Yu-Wei; Yu, Chang-Ho |
| 國立成功大學 |
2012-09 |
Electrochemical Corrosion Behaviour of Lead-Free Solder Alloys in 3.5% Nacl Solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2012-07 |
Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
|
Chen, Wei-Yu; Chiu, Tsung-Chieh; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-07 |
The performance and fracture mechanism of solder joints under mechanical reliability test
|
Jang, Wei-Luen; Wang, Tai-Siang; Lai, Yen-Fen; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
|
Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012-04 |
The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2012-04 |
Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2012-04 |
Nanoscale Electrodeposition of Copper on an AFM Tip and Its Morphological Investigations
|
Mohanty, Udit Surya; Chen, S. Y.; Lin, Kwang-Lung |
| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012 |
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints
|
Liu, De-Shin; Hsu, Chang-Lin; Kuo, Chia-Yuan; Huang, Ya-Ling; Lin, Kwang-Lung; Shen, Geng-Shin |
| 國立成功大學 |
2011-11 |
The formation of electric circuits with carbon nanotubes and copper using tin solder
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2011-10 |
Supersaturation induced by current stressing
|
Chiu, Ying-Ta; Liu, Chia-Hao; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-08 |
Electromigration-induced microstructural evolution in lead-free and lead-tin solders
|
Lin, Kwang-Lung |
| 國立成功大學 |
2011-06-01 |
Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate
|
Jang, Wei-Luen; Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2011-05-18 |
The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate
|
Pan, Chien-Cheng;Lin, Kwang-Lung |
| 國立成功大學 |
2009-12 |
The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-12 |
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
|
Mittal, Jagjiwan; Kuo, Shih-Ming; Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2009-07-15 |
Recrystallization under electromigration of a solder alloy
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2009-06 |
The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-02-05 |
Microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment
|
Hsuan, Teng-Chun; Lin, Kwang-Lung |
| 國立成功大學 |
2009-02 |
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry
|
Wu, Y. K.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2009-01 |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
|
Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2009 |
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
|
Yeh, T. K.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2008-10 |
Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2008-09 |
Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2008-08-11 |
The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate
|
Pan, Chien-Cheng; Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2008-05-29 |
Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
