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"lin kwang lung"
Showing items 101-110 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2003-09 |
Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
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Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Electrodeposition of eutectic Sn-Zn alloy by pulse plating
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Lin, Kwang-Lung; Sun, Li-Min |
| 國立成功大學 |
2003-09 |
The Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al
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Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P
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Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2003-08-01 |
The cathode current efficiency of flip-chip solder bump plating
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Lin, Kwang-Lung; Liu, Yeh-Hsiu |
| 國立成功大學 |
2003-08 |
Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C
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Cheng, Shou-Chang; Lin, Kwang-Lung |
| 國立成功大學 |
2003-07 |
Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders
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Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2003-05-31 |
Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating
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Lin, Chien-Tai; Lin, Kwang-Lung |
| 東方設計學院 |
2003-05-27 |
Improvement in the Properties of Sn-Zn Eutectic Based Pb-free Solder
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Lin, Kwang-Lung; 陳剛毅; Chen, Kang-I; Hsu, Hui-Min; Shi, Chia-Ling; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2003-05 |
Structural evolution of electroless nickel bump
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Lin, Kwang-Lung; Wu, Chih-Hau |
Showing items 101-110 of 130 (13 Page(s) Totally)
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