| 國立成功大學 |
2003-02 |
Wetting interaction between Sn-Zn-Ag solders and Cu
|
Lin, Kwang-Lung; Shih, Chia-Ling |
| 國立成功大學 |
2003-01 |
Mechanical strength of Sn-3.5Ag-based solders and related bondings
|
Chuang, Chiang-Ming; Shih, Po-Cheng; Lin, Kwang-Lung |
| 東方設計學院 |
2002-12-03 |
Effects of Gallium on Wettability, Microstructures and mechanical Properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga Solder Alloys
|
陳剛毅; Chen, Kang-I; Lin, Kwang-Lung; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2002-11 |
Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder
|
Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2002-09 |
The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
| 國立成功大學 |
2002-09 |
Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment
|
Lin, Kwang-Lung; Hsiao, Chih-Chun; Chen, Kaug-I |
| 國立成功大學 |
2002-08-15 |
Effect of thiourea and lead acetate on the deposition of electroless nickel
|
Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2002-05-01 |
Lead-free Solder
|
Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 國立成功大學 |
2002-01-15 |
Lead-free Solder
|
Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 東方設計學院 |
2002 |
The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys – the Effect of Ga
|
陳剛毅; Chen, Kang-I; Lin, Kwang-Lung; (東方工商專科學校電子工程科) |
| 國立成功大學 |
2001-12 |
Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2001-09-03 |
Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives
|
Lin, Kwang-Lung; Chang, Yu-Lan; Huang, Chiao-Chan; Li, Fang-I; Hsu, Jen-Che |
| 國立成功大學 |
2001-09 |
Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact
|
Lin, Kwang-Lung; Hsu, Hui-Min |
| 國立成功大學 |
2000-12 |
Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
| 國立成功大學 |
2000-12 |
Solder thickness variation with respect to soldering parameters
|
Lin, Kwang-Lung; Yao, S. |
| 國立成功大學 |
2000-08 |
The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07-17 |
Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07 |
Intermittent electroless nickel deposition in a fine trench flip chip bump pad
|
Lin, Kwang-Lung; Chen, C. L. |
| 國立成功大學 |
2000-03 |
Wave soldering bumping process incorporating electroless nickel UBM
|
Lin, Kwang-Lung; Chen, Jun-Wen |
| 國立成功大學 |
2000-03 |
Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
