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總筆數 :2856704
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53772951
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2620
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"lin kwang lung"的相關文件
顯示項目 116-125 / 130 (共13頁)
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| 國立成功大學 |
2002-09 |
Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment
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Lin, Kwang-Lung; Hsiao, Chih-Chun; Chen, Kaug-I |
| 國立成功大學 |
2002-08-15 |
Effect of thiourea and lead acetate on the deposition of electroless nickel
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Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2002-05-01 |
Lead-free Solder
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Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 國立成功大學 |
2002-01-15 |
Lead-free Solder
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Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 東方設計學院 |
2002 |
The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys – the Effect of Ga
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陳剛毅; Chen, Kang-I; Lin, Kwang-Lung; (東方工商專科學校電子工程科) |
| 國立成功大學 |
2001-12 |
Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps
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Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2001-09-03 |
Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives
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Lin, Kwang-Lung; Chang, Yu-Lan; Huang, Chiao-Chan; Li, Fang-I; Hsu, Jen-Che |
| 國立成功大學 |
2001-09 |
Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact
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Lin, Kwang-Lung; Hsu, Hui-Min |
| 國立成功大學 |
2000-12 |
Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si
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Lin, Kwang-Lung; Hsu, Kun-Tzu |
| 國立成功大學 |
2000-12 |
Solder thickness variation with respect to soldering parameters
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Lin, Kwang-Lung; Yao, S. |
顯示項目 116-125 / 130 (共13頁)
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