|
English
|
正體中文
|
简体中文
|
Total items :2856704
|
|
Visitors :
53740503
Online Users :
1446
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"lin kwang lung"
Showing items 121-130 of 130 (6 Page(s) Totally)
<< < 1 2 3 4 5 6 > >>
View [10|25|50] records per page
| 國立成功大學 |
2001-12 |
Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2001-09-03 |
Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives
|
Lin, Kwang-Lung; Chang, Yu-Lan; Huang, Chiao-Chan; Li, Fang-I; Hsu, Jen-Che |
| 國立成功大學 |
2001-09 |
Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact
|
Lin, Kwang-Lung; Hsu, Hui-Min |
| 國立成功大學 |
2000-12 |
Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
| 國立成功大學 |
2000-12 |
Solder thickness variation with respect to soldering parameters
|
Lin, Kwang-Lung; Yao, S. |
| 國立成功大學 |
2000-08 |
The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07-17 |
Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07 |
Intermittent electroless nickel deposition in a fine trench flip chip bump pad
|
Lin, Kwang-Lung; Chen, C. L. |
| 國立成功大學 |
2000-03 |
Wave soldering bumping process incorporating electroless nickel UBM
|
Lin, Kwang-Lung; Chen, Jun-Wen |
| 國立成功大學 |
2000-03 |
Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
Showing items 121-130 of 130 (6 Page(s) Totally)
<< < 1 2 3 4 5 6 > >>
View [10|25|50] records per page
|
