English  |  正體中文  |  简体中文  |  Total items :2856704  
Visitors :  53740503    Online Users :  1446
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"lin kwang lung"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 121-130 of 130  (6 Page(s) Totally)
<< < 1 2 3 4 5 6 > >>
View [10|25|50] records per page

Institution Date Title Author
國立成功大學 2001-12 Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps Chen, Chun-Jen; Lin, Kwang-Lung
國立成功大學 2001-09-03 Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives Lin, Kwang-Lung; Chang, Yu-Lan; Huang, Chiao-Chan; Li, Fang-I; Hsu, Jen-Che
國立成功大學 2001-09 Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact Lin, Kwang-Lung; Hsu, Hui-Min
國立成功大學 2000-12 Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si Lin, Kwang-Lung; Hsu, Kun-Tzu
國立成功大學 2000-12 Solder thickness variation with respect to soldering parameters Lin, Kwang-Lung; Yao, S.
國立成功大學 2000-08 The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow Chen, Chun-Jen; Lin, Kwang-Lung
國立成功大學 2000-07-17 Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum Chen, Chun-Jen; Lin, Kwang-Lung
國立成功大學 2000-07 Intermittent electroless nickel deposition in a fine trench flip chip bump pad Lin, Kwang-Lung; Chen, C. L.
國立成功大學 2000-03 Wave soldering bumping process incorporating electroless nickel UBM Lin, Kwang-Lung; Chen, Jun-Wen
國立成功大學 2000-03 Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths Lin, Kwang-Lung; Hsu, Kun-Tzu

Showing items 121-130 of 130  (6 Page(s) Totally)
<< < 1 2 3 4 5 6 > >>
View [10|25|50] records per page