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總筆數 :2856704
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53747098
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1189
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"lin kwang lung"的相關文件
顯示項目 121-130 / 130 (共13頁)
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| 國立成功大學 |
2001-12 |
Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2001-09-03 |
Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives
|
Lin, Kwang-Lung; Chang, Yu-Lan; Huang, Chiao-Chan; Li, Fang-I; Hsu, Jen-Che |
| 國立成功大學 |
2001-09 |
Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact
|
Lin, Kwang-Lung; Hsu, Hui-Min |
| 國立成功大學 |
2000-12 |
Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
| 國立成功大學 |
2000-12 |
Solder thickness variation with respect to soldering parameters
|
Lin, Kwang-Lung; Yao, S. |
| 國立成功大學 |
2000-08 |
The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07-17 |
Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07 |
Intermittent electroless nickel deposition in a fine trench flip chip bump pad
|
Lin, Kwang-Lung; Chen, C. L. |
| 國立成功大學 |
2000-03 |
Wave soldering bumping process incorporating electroless nickel UBM
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Lin, Kwang-Lung; Chen, Jun-Wen |
| 國立成功大學 |
2000-03 |
Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
顯示項目 121-130 / 130 (共13頁)
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