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"lin kwang lung"
Showing items 126-130 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2000-08 |
The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
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Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07-17 |
Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
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Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07 |
Intermittent electroless nickel deposition in a fine trench flip chip bump pad
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Lin, Kwang-Lung; Chen, C. L. |
| 國立成功大學 |
2000-03 |
Wave soldering bumping process incorporating electroless nickel UBM
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Lin, Kwang-Lung; Chen, Jun-Wen |
| 國立成功大學 |
2000-03 |
Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths
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Lin, Kwang-Lung; Hsu, Kun-Tzu |
Showing items 126-130 of 130 (13 Page(s) Totally)
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