| 國立成功大學 |
2012-02-15 |
Dissolution of Sn in a SnPb solder bump under current stressing
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2012 |
A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints
|
Liu, De-Shin; Hsu, Chang-Lin; Kuo, Chia-Yuan; Huang, Ya-Ling; Lin, Kwang-Lung; Shen, Geng-Shin |
| 國立成功大學 |
2011-11 |
The formation of electric circuits with carbon nanotubes and copper using tin solder
|
Mittal, Jagjiwan; Lin, Kwang Lung |
| 國立成功大學 |
2011-10 |
Supersaturation induced by current stressing
|
Chiu, Ying-Ta; Liu, Chia-Hao; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2011-08 |
Electromigration-induced microstructural evolution in lead-free and lead-tin solders
|
Lin, Kwang-Lung |
| 國立成功大學 |
2011-06-01 |
Effect of thermal cycling on the adhesion strength of Ti/Ni/Ag films on AlN substrate
|
Jang, Wei-Luen; Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2011-05-18 |
The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate
|
Pan, Chien-Cheng;Lin, Kwang-Lung |
| 國立成功大學 |
2009-12 |
The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-12 |
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
|
Mittal, Jagjiwan; Kuo, Shih-Ming; Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2009-07-15 |
Recrystallization under electromigration of a solder alloy
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2009-06 |
The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2009-02-05 |
Microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment
|
Hsuan, Teng-Chun; Lin, Kwang-Lung |
| 國立成功大學 |
2009-02 |
Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry
|
Wu, Y. K.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2009-01 |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
|
Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2009 |
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
|
Yeh, T. K.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2008-10 |
Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2008-09 |
Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution
|
Mohanty, Udit Surya; Lin, Kwang-Lung |
| 國立成功大學 |
2008-08-11 |
The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate
|
Pan, Chien-Cheng; Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2008-07 |
Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test
|
Chiu, Ying-Ta; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2008-05-29 |
Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2008-04 |
The micro-impact fracture behavior of lead-free solder ball joints
|
Huang, Y. L.; Lin, Kwang-Lung; Liu, D. S. |
| 國立成功大學 |
2008-04 |
Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich
|
Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2008-03-20 |
IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls
|
Lin, Kwang-Lung; Shih, Po-Cheng |
| 國立成功大學 |
2008-01 |
Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination
|
Chiu, Tsung-Chieh; Lin, Kwang-Lung |
| 國立成功大學 |
2008 |
Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip
|
Lin, Kwang-Lung; Chen, S. Y.; Mohanty, Udit-Surya |
