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"lin kwang lung"
Showing items 61-70 of 130 (13 Page(s) Totally)
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| 國立成功大學 |
2007-05-15 |
Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder
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Hsuan, Teng-Chun; Lin, Kwang-Lung |
| 國立成功大學 |
2007-05 |
Microstructure evolution during electromigration between Sn-9Zn solder and Cu
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Kuo, Shih-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2007-04 |
Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-01 |
Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2006-12 |
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
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Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2006-12 |
Lead-free solder implementation: Reliability, alloy development, new technology - Foreword
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Chawla, Nik; Chada, Srinivas; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Lucas, Jim; Turbini, Laura |
| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2006-06-08 |
Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy
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Chen, Kang-I; Cheng, Shou-Chang; Wu, Sean; Lin, Kwang-Lung |
| 國立成功大學 |
2006-05 |
Dissolution behavior of Cu and Ag substrates in molten solders
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Yeh, Po-Yi; Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2006-03 |
The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solution
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Mohanty, Udit S.; Lin, Kwang-Lung |
Showing items 61-70 of 130 (13 Page(s) Totally)
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