| 國立成功大學 |
2005-03 |
Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders
|
Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2005-03 |
Early dissolution behavior of copper in a molten Sn-Zn-Ag solder
|
Yu, Chang-Ho; Lin, Kwang-Lung |
| 國立成功大學 |
2005-01-03 |
The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposit on Al
|
Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2005-01 |
Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2005-01 |
Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAl solder alloys
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
| 國立成功大學 |
2004-12 |
Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2004-12 |
Special issue on lead-free solders and processing issues relevant to microelectronic packaging - Foreword
|
Chada, Srinivas; Turbini, Laura J.; Kang, Sung K.; Lin, Kwang-Lung; Notis, Michael R.; Yu, Jin |
| 國立成功大學 |
2004-11 |
Effects of current density and deposition time on electrical resistivity of electroplated Cu layers
|
Lin, Chien-Tai; Lin, Kwang-Lung |
| 國立成功大學 |
2004-09 |
Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys
|
Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2004-08 |
Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test
|
Liu, Yeh-Hsiu; Chuang, Chiang-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2004-03 |
Microstructures, thermal and tensile properties of Sn-Zn-Ga alloys
|
Song, Jenn-Ming; Liu, Nai-Shuo; Lin, Kwang-Lung |
| 國立成功大學 |
2004-02 |
Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2004-01 |
The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates
|
Chuang, Chiang-Ming; Hung, Hui-Tzu; Liu, Pei-Chi; Lin, Kwang-Lung |
| 國立成功大學 |
2003-12 |
A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder
|
Lin, Kwang-Lung; Chen, Kang-I; Shi, Po-Cheng |
| 國立成功大學 |
2003-12 |
Microstructure and thermal behavior of Sn-Zn-Ag solders
|
Lin, Kwang-Lung; Shih, Chia-Ling |
| 國立成功大學 |
2003-12 |
Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword
|
Lucas, James P.; Chada, Srini; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Ready, Jud; Yu, Jin |
| 國立成功大學 |
2003-12 |
Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate
|
Chuang, Chiang-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2003-11-15 |
Preparation of Cu1-xTax films and the material interaction in the Si/Cu1-xTax/Cu structure
|
Lin, Chien-Tai; Lin, Kwang-Lung |
| 國立成功大學 |
2003-10 |
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag
|
Chen, Kang-I; Lin, Kwang-Lung |
| 國立成功大學 |
2003-10 |
The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga
|
Chen, Kang-I; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys
|
Song, Jenn-Ming; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Electrodeposition of eutectic Sn-Zn alloy by pulse plating
|
Lin, Kwang-Lung; Sun, Li-Min |
| 國立成功大學 |
2003-09 |
The Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al
|
Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2003-09 |
Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P
|
Hsu, Jen-Che; Lin, Kwang-Lung |
| 國立成功大學 |
2003-08-01 |
The cathode current efficiency of flip-chip solder bump plating
|
Lin, Kwang-Lung; Liu, Yeh-Hsiu |
| 國立成功大學 |
2003-08 |
Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
| 國立成功大學 |
2003-07 |
Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2003-05-31 |
Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating
|
Lin, Chien-Tai; Lin, Kwang-Lung |
| 東方設計學院 |
2003-05-27 |
Improvement in the Properties of Sn-Zn Eutectic Based Pb-free Solder
|
Lin, Kwang-Lung; 陳剛毅; Chen, Kang-I; Hsu, Hui-Min; Shi, Chia-Ling; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2003-05 |
Structural evolution of electroless nickel bump
|
Lin, Kwang-Lung; Wu, Chih-Hau |
| 國立成功大學 |
2003-02 |
Wetting interaction between Sn-Zn-Ag solders and Cu
|
Lin, Kwang-Lung; Shih, Chia-Ling |
| 國立成功大學 |
2003-01 |
Mechanical strength of Sn-3.5Ag-based solders and related bondings
|
Chuang, Chiang-Ming; Shih, Po-Cheng; Lin, Kwang-Lung |
| 東方設計學院 |
2002-12-03 |
Effects of Gallium on Wettability, Microstructures and mechanical Properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga Solder Alloys
|
陳剛毅; Chen, Kang-I; Lin, Kwang-Lung; (東方技術學院電子與資訊系) |
| 國立成功大學 |
2002-11 |
Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder
|
Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2002-09 |
The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
| 國立成功大學 |
2002-09 |
Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment
|
Lin, Kwang-Lung; Hsiao, Chih-Chun; Chen, Kaug-I |
| 國立成功大學 |
2002-08-15 |
Effect of thiourea and lead acetate on the deposition of electroless nickel
|
Lin, Kwang-Lung; Hwang, Jia-Wei |
| 國立成功大學 |
2002-05-01 |
Lead-free Solder
|
Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 國立成功大學 |
2002-01-15 |
Lead-free Solder
|
Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 東方設計學院 |
2002 |
The Microstructures and Mechanical Properties of the Sn-Zn-Ag-Al-Ga Solder Alloys – the Effect of Ga
|
陳剛毅; Chen, Kang-I; Lin, Kwang-Lung; (東方工商專科學校電子工程科) |
| 國立成功大學 |
2001-12 |
Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2001-09-03 |
Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives
|
Lin, Kwang-Lung; Chang, Yu-Lan; Huang, Chiao-Chan; Li, Fang-I; Hsu, Jen-Che |
| 國立成功大學 |
2001-09 |
Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact
|
Lin, Kwang-Lung; Hsu, Hui-Min |
| 國立成功大學 |
2000-12 |
Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
| 國立成功大學 |
2000-12 |
Solder thickness variation with respect to soldering parameters
|
Lin, Kwang-Lung; Yao, S. |
| 國立成功大學 |
2000-08 |
The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07-17 |
Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
|
Chen, Chun-Jen; Lin, Kwang-Lung |
| 國立成功大學 |
2000-07 |
Intermittent electroless nickel deposition in a fine trench flip chip bump pad
|
Lin, Kwang-Lung; Chen, C. L. |
| 國立成功大學 |
2000-03 |
Wave soldering bumping process incorporating electroless nickel UBM
|
Lin, Kwang-Lung; Chen, Jun-Wen |
| 國立成功大學 |
2000-03 |
Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths
|
Lin, Kwang-Lung; Hsu, Kun-Tzu |
