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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2019-04-02T06:04:21Z Mean-time-to-crack Model of Microbump Interconnect in FCGBA Package under Thermal Cyclic Test Chen, Chien-Chang; Wu, Wei-Chen; Chin, Ching-Yu; Chen, Hung-Ming; Lin, Vito; Chen, Eason

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