| 臺大學術典藏 |
2020-06-04T07:54:10Z |
A 53 to 84 GHz CMOS power amplifier with 10.8-dBm output power and 31 GHz 3-dB bandwidth
|
Chiang, P.-H.;Lin, W.-H.;Huang, T.-Y.;Wang, H.; Chiang, P.-H.; Lin, W.-H.; Huang, T.-Y.; Wang, H.; HUEI WANG |
| 臺大學術典藏 |
2020-06-04T07:53:46Z |
A 0.7-V 60-GHz low-power LNA with forward body bias technique in 90 nm CMOS process
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Lin, W.-H.;Tsai, J.-H.;Jen, Y.-N.;Huang, T.-W.;Wang, H.; Lin, W.-H.; Tsai, J.-H.; Jen, Y.-N.; Huang, T.-W.; Wang, H.; HUEI WANG |
| 臺大學術典藏 |
2020-06-01T04:31:03Z |
Molecular scanning of the human sorbin and SH3-domain-containing-1 (SORBS1) gene: Positive association of the T228A polymorphism with obesity and type 2 diabetes
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LEE-MING CHUANG;Tai T.-Y.;Lee K.-C.;Chang H.-M.;Chiu K.C.;Lin W.-H.; Lin W.-H.; Chiu K.C.; Chang H.-M.; Lee K.-C.; Tai T.-Y.; LEE-MING CHUANG |
| 臺大學術典藏 |
2020-06-01T04:30:54Z |
Association study of genetic polymorphisms of SLC2A10 gene and type 2 diabetes in the Taiwanese population
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Chen Y.T.;Cheng C.H.;Hsieh P.S.;Yeh J.I.;Chen C.H.;LEE-MING CHUANG;Lin W.H.; Lin W.H.; LEE-MING CHUANG; Chen C.H.; Yeh J.I.; Hsieh P.S.; Cheng C.H.; Chen Y.T. |
| 臺大學術典藏 |
2020-05-25T02:46:15Z |
SLC2A10 genetic polymorphism predicts development of peripheral arterial disease in patients with type 2 diabetes. SLC2A10 and PAD in type 2 diabetes
|
Jiang Y.-D.;Chang Y.-C.;Chiu Y.-F.;Tien-Jyun Chang;Li H.-Y.;Lin W.-H.;Yuan H.-Y.;Chen Y.-T.;Chuang L.-M.; Jiang Y.-D.; Chang Y.-C.; Chiu Y.-F.; TIEN-JYUN CHANG; Li H.-Y.; Lin W.-H.; Yuan H.-Y.; Chen Y.-T.; Chuang L.-M. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Effects of zinc additions on the microstructure and melting temperatures of Al-Si-Cu filler metals
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Tsao, L.C.; Chiang, M.J.; Lin, W.H.; Cheng, M.D.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
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Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
|
TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 臺大學術典藏 |
2020-03-27T02:03:45Z |
Image of the month: Bezoars
|
Teng Y.-C.; KAO-LANG LIU; Lin W.-H.; Chen S.-J. |
