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Showing items 651-660 of 710  (71 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2006 Sm22.6 antigen is an inhibitor to human thrombin Lin Y.L.; Shiping He
國立臺灣大學 2006 In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing Tsai, C.M.; Lai, Yi-Shao; Lin, Y.L.; Chang, C.W.; Kao, C.R.
國立臺灣大學 2006 Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration Lin, Y.L.; Lai, Y.S.; Tsai, C.M.; Kao, C.R.
國立臺灣大學 2006 Relationship between chlorine consumption and chlorination by-products formation for model compounds Chang, E.E.; Chiang, P.C.; Chao, S.H.; Lin, Y.L.
國立臺灣大學 2006 Evaluation of Network Robustness for Given Defense Resource Allocation Strategie Lin, F.Y.-S.; Tsang, P.-H.; Chen, C.-H.; Tseng, C.-L.; Lin, Y.-L.
國立臺灣大學 2006 Molecular cloning of caffeoyl-CoA-3-O-methyltransferase gene from Chamaecyparis formosensis and lignin analyzing in its transgenic tobacco. Wang, S.Y.; Lin, Y.L.; Chu, F.H.
國立臺灣大學 2005-08 Polysaccharide purified from Ganoderma lucidum induced activation and maturation of human monocyte-derived dendritic cells by the NF-kappa B and p38 mitogen-activated protein kinase pathways Lin, Y.-L.; Liang, Y.-C.; Lee, S.-S.; Chiang, B.-L
淡江大學 2005-07 Epoxidation of protected (1,4,5)-cyclohex-2-ene-triols and their acid hydrolysis to synthesize quercitols from D-(-)-quinic acid Shih, T. L.; Lin, Y. L.
國立臺灣大學 2005-04 Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學 2005-01 Electromigration induced failure in flip chip solder joints Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R.

Showing items 651-660 of 710  (71 Page(s) Totally)
<< < 61 62 63 64 65 66 67 68 69 70 > >>
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