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"lin yc"
Showing items 251-260 of 535 (54 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:17:40Z |
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
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Lin, YC; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:17:34Z |
Growth mode transfer of self-assembled CdSe quantum dots grown by molecular beam epitaxy
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Lai, YJ; Lin, YC; Fu, CP; Yang, CS; Chia, CH; Chuu, DS; Chen, WK; Lee, MC; Chou, WC; Kuo, MC; Wang, JS |
| 國立交通大學 |
2014-12-08T15:17:17Z |
Comparison between immersion-based and toboggan-based watershed image segmentation
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Lin, YC; Tsai, YP; Hung, YP; Shih, ZC |
| 國立交通大學 |
2014-12-08T15:17:04Z |
Optical characterization of ZnSe epilayers and ZnCdSe/ZnSe quantum wells grown on Ge/Ge0.95Si0.05/Ge0.9Si0.1/Si virtual substrates
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Ku, JT; Kuo, MC; Shen, JL; Chiu, KC; Yang, TH; Luo, GL; Chang, CY; Lin, YC; Fu, CP; Chuu, DS; Chia, CH; Chou, WC |
| 國立交通大學 |
2014-12-08T15:16:17Z |
Device linearity comparison of uniformly doped and delta-doped In0.52Al0.48As/In0.6Ga0.4As metamorphic HEMTs
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Lin, YC; Chang, EY; Yamaguchi, H; Hirayama, Y; Chang, XY; Chang, CY |
| 國立交通大學 |
2014-12-08T15:05:00Z |
REDUCTION OF RESIDUAL-STRESS BY PARALLEL HEAT WELDING IN SMALL SPECIMENS OF TYPE-304 STAINLESS-STEEL
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CHOU, CP; LIN, YC |
| 國立交通大學 |
2014-12-08T15:04:47Z |
RESIDUAL-STRESS DUE TO PARALLEL HEAT WELDING IN SMALL SPECIMENS OF TYPE 304 STAINLESS-STEEL
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LIN, YC; CHOU, CP |
| 國立交通大學 |
2014-12-08T15:03:34Z |
A NEW TECHNIQUE FOR REDUCING THE RESIDUAL-STRESS INDUCED BY WELDING IN TYPE-304 STAINLESS-STEEL
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LIN, YC; CHOU, CP |
| 國立交通大學 |
2014-12-08T15:03:33Z |
0.35-MU-M PATTERN FABRICATION USING QUARTZ-ETCH ATTENUATE PHASE-SHIFTING MASK IN AN I-LINE STEPPER WITH A 0.50-NA AND A 0.60-SIGMA
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LOONG, WA; SHY, SL; LIN, YC |
| 國立交通大學 |
2014-12-08T15:03:21Z |
ERROR INDUCED BY LOCAL YIELDING AROUND HOLE IN HOLE DRILLING METHOD FOR MEASURING RESIDUAL-STRESS OF MATERIALS
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LIN, YC; CHOU, CP |
Showing items 251-260 of 535 (54 Page(s) Totally)
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