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| 中國文化大學 |
2018-12 |
Preparation of photosensitive polyimides (PSPIs) and their feasible evaluation for lithographic insulation patterns (LIPs) of integrated circuits (ICs) without negative photoresists
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Chen, MH (Chen, Meng-Hsin); Lai, CC (Lai, Chiu-Chun); Chen, HL (Chen, Hsin-Lung); Lin, YH (Lin, Yi-Hung); Huang, KY (Huang, Kuan-Yeh); Lin, CH (Lin, Chih-Hsiang); Hsiao, HT (Hsiao, Ho-Ting); Liu, LC (Liu, Lung-Chang); Chen, CM (Chen, Chien-Ming) |
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