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"lin yu wei"
Showing items 41-50 of 72 (8 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:12:37Z |
An indexed-scaling pipelined FFT processor for OFDM-based WPAN applications
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Chen, Yuan; Tsao, Yu-Chi; Lin, Yu-Wei; Lin, Chin-Hung; Lee, Chen-Yi |
| 中國文化大學 |
2014-06 |
足球訓練介入對國小學童健康體適能之影響
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林育葦; Lin, Yu-Wei |
| 國立屏東大學 |
2014 |
莊子寓言中的創意研究－以〈逍遙遊〉為核心
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林育緯; Lin, Yu-Wei |
| 臺北醫學大學 |
2014 |
Treatment plan comparison between stereotactic body radiation therapy techniques for prostate cancer: Non-isocentric CyberKnife versus isocentric RapidArc
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Lin, Yu-Wei;Lin, Kuei-Hua;Ho, Hsiu-Wen;Lin, Hsiu-Man;Lin, Li-Ching;Lee, Steve P.;Chui, Chen-Shou |
| 國立臺灣大學 |
2014 |
東亞-西太平洋夏季季風之年際變化
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林育鮪; Lin, Yu-Wei |
| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-08-22 |
錫銀/錫銀銅銲錫與鎳基材在迴焊初始階段之界面反應行為
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林育瑋; Lin, Yu-Wei |
| 國立成功大學 |
2013-07-23 |
錫銀/錫銀銅銲錫與鎳基材在迴焊初始階段之界面反應行為
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林育瑋; Lin, Yu-Wei |
| 國立成功大學 |
2013-01 |
Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow
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Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2012-10 |
The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process
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Lin, Kwang-Lung; Lin, Yu-Wei; Yu, Chang-Ho |
Showing items 41-50 of 72 (8 Page(s) Totally)
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