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"lin yu wei"的相关文件
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| 國立成功大學 |
2013-09 |
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
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Lin, Yu-Wei; Ke, Wun-Bin; Wang, Ren-You; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立成功大學 |
2013-08-22 |
錫銀/錫銀銅銲錫與鎳基材在迴焊初始階段之界面反應行為
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林育瑋; Lin, Yu-Wei |
| 國立成功大學 |
2013-07-23 |
錫銀/錫銀銅銲錫與鎳基材在迴焊初始階段之界面反應行為
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林育瑋; Lin, Yu-Wei |
| 國立成功大學 |
2013-01 |
Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow
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Lin, Yu-Wei; Lin, Kwang-Lung |
| 國立成功大學 |
2012-10 |
The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process
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Lin, Kwang-Lung; Lin, Yu-Wei; Yu, Chang-Ho |
| 國立成功大學 |
2012-07 |
The expression and prognostic significance of hepatoma-derived growth factor in oral cancer
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Lin, Yu-Wei; Li, Chien-Feng; Chen, Hsuan-Yu; Yen, Ching-Yu; Lin, Li-Ching; Huang, Chao-Cheng; Huang, Hsuan-Ying; Wu, Ping-Ching; Chen, Chang-Han; Chen, San-Cher; Tai, Ming-Hong |
| 淡江大學 |
2012-06-24 |
Merging Grid into Clustering-based Routing Protocol for Wireless Sensor Networks
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王英宏; Wang, Ying-hong; Lin, Yu-wei; Lin, Yu-yu; Chang, Hang-ming |
| 國立成功大學 |
2012-05-01 |
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
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Lin, Yu-Wei; Wang, Ren-You; Ke, Wun-Bin; Wang, I-Sheng; Chiu, Ying-Ta; Lu, Kuo-Chang; Lin, Kwang-Lung; Lai, Yi-Shao |
| 國立臺灣大學 |
2012 |
高分子場效電晶體型記憶體之微結構及表面改質對元件特性之影響
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林育威; Lin, Yu-Wei |
| 淡江大學 |
2011 |
應用於無線感測網路之合併網格叢集化路由協定
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林育緯; Lin, Yu-Wei |
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