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Institution Date Title Author
國立臺灣科技大學 2016 Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process Lin, Z.-C;Wu, D.-W;Hong, G.-E.
國立臺灣科技大學 2016 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W.
國立臺灣科技大學 2015 Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2015 An innovative method and experiment for fabricating bulgy shape nanochannel using AFM Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y.
國立臺灣科技大學 2015 Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon Lin, Z.-C;Lin, C.-T;Hsu, Y.-C.
國立交通大學 2014-12-08T15:15:56Z Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy Lin, S. D.; Lin, Z. C.; Lee, C. P.
國立交通大學 2014-12-08T15:14:39Z Mobility asymmetry in InGaAs/InAlAs heterostructures with InAs quantum wires Lin, Z. C.; Hsieh, W. H.; Lee, C. P.; Suen, Y. W.
國立交通大學 2014-12-08T15:12:46Z Ordering of stacked InAs/GaAs quantum-wires in InAlAs/InGaAs matrix on (100) InP substrates Lin, Z. C.; Lin, S. D.; Lee, C. P.
國立臺灣科技大學 2014 Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2014 Simulation of temperature field during nanoscale orthogonal cutting of single-crystal silicon by molecular statics method Lin, Z.-C.;Lin, M.-H.;Hsu, Y.-C.

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