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教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
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機構 日期 題名 作者
國立臺灣科技大學 2014 Fabrication method and experiment study of nanoscale trapezoidal groove on sapphire substrate by using atomic force microscope under a fixed cutting depth and changed down force Lin, Z.-C.;Tsai, J.-S.;Hsu, Y.-C.;Lin, C.-T.
國立臺灣科技大學 2014 A study of simulation of three-dimensional quasi-steady molecular statics nanoscale orthogonal cutting of single-crystal silicon material having rows of atoms with vacancy defect Lin, Z.-C.;Jian, C.-S.;Wang, R.-Y.
國立臺灣科技大學 2013 Simulation and temperature rise analysis for nanocutting sapphire workpiece with quasi-steady molecular statics method Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學 2013 Establishment and analysis of tapping mode atomic force microscopy simulative measurement model affected by external environment vibration Lin, Z.-C.;Chou, M.-H.
國立臺灣科技大學 2013 Investigation of the abrasive removal depth for bowl-shaped structure of sapphire wafer under compensated chemical mechanical polishing Lin, Z.C.;Wang, R.Y.
國立臺灣科技大學 2012 Analysis on the temperature rise produced by plastic deformation heat for nanoscale orthogonal cutting of copper workpiece Lin, Z.-C.;Hsu, Y.-C.;Chen, L.-K.
國立臺灣科技大學 2012 A grey weighting density-based clustering algorithm for LAO wafer defect inspection Huang, M.-L.;Tsai, M.-J.;Chen, C.C.;Lin, S.C.;Lin, Z.C.
國立臺灣科技大學 2012 A calculating method for the fewest cutting passes on sapphire substrate at a certain depth using specific down force energy with an AFM probe Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學 2012 A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads Lin, Z.-C.;Huang, W.-S.;Tsai, J.-S.
國立臺灣科技大學 2012 Analytical study of simulated nanoscale abrasive cutting of sapphire substrate by three dimensional quasi-steady molecular statics Lin, Z.-C.;Wang, R.-Y.

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