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Showing items 11-60 of 220  (5 Page(s) Totally)
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Institution Date Title Author
國立臺灣科技大學 2017 A study of patent analysis of LED bicycle light by using modified DEMATEL and life span Lin, Z.-C.;Hong, G.-E.;Cheng, P.-F.
國立臺灣科技大學 2017 Analysis on Patent Categorization of LED Standing/Desk Lamp Patents with Considering the Position Weight Lin, Z.-C.;Lin, M.-H.;Hong, G.-E.
國立臺灣科技大學 2017 Simplified Methodology for Ride Comfort Assessment Based on Wheel/Rail Contact Geometry Synthesis Wu, Y.-E.;Chien, M.-H.;Liao, K.-L.;Lin, Z.-C.;Chieng, W.-H.
國立臺灣科技大學 2017 Experimental analysis on surface profile of sapphire wafer after polishing by chemical mechanical polishing Lin, Z.-C.;Huang, W.-S.;Ding, H.-Y.
國立臺灣科技大學 2017 A study of specific down force energy and cutting depth of sapphire substrate affected by different dipping temperatures of slurry Lin Z.-C.; Ding H.-Y.; Chen P.-Y.
國立臺灣科技大學 2016 Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process Lin, Z.-C;Wu, D.-W;Hong, G.-E.
國立臺灣科技大學 2016 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W.
國立臺灣科技大學 2015 Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2015 An innovative method and experiment for fabricating bulgy shape nanochannel using AFM Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y.
國立臺灣科技大學 2015 Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon Lin, Z.-C;Lin, C.-T;Hsu, Y.-C.
國立交通大學 2014-12-08T15:15:56Z Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy Lin, S. D.; Lin, Z. C.; Lee, C. P.
國立交通大學 2014-12-08T15:14:39Z Mobility asymmetry in InGaAs/InAlAs heterostructures with InAs quantum wires Lin, Z. C.; Hsieh, W. H.; Lee, C. P.; Suen, Y. W.
國立交通大學 2014-12-08T15:12:46Z Ordering of stacked InAs/GaAs quantum-wires in InAlAs/InGaAs matrix on (100) InP substrates Lin, Z. C.; Lin, S. D.; Lee, C. P.
國立臺灣科技大學 2014 Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2014 Simulation of temperature field during nanoscale orthogonal cutting of single-crystal silicon by molecular statics method Lin, Z.-C.;Lin, M.-H.;Hsu, Y.-C.
國立臺灣科技大學 2014 Fabrication method and experiment study of nanoscale trapezoidal groove on sapphire substrate by using atomic force microscope under a fixed cutting depth and changed down force Lin, Z.-C.;Tsai, J.-S.;Hsu, Y.-C.;Lin, C.-T.
國立臺灣科技大學 2014 A study of simulation of three-dimensional quasi-steady molecular statics nanoscale orthogonal cutting of single-crystal silicon material having rows of atoms with vacancy defect Lin, Z.-C.;Jian, C.-S.;Wang, R.-Y.
國立臺灣科技大學 2013 Simulation and temperature rise analysis for nanocutting sapphire workpiece with quasi-steady molecular statics method Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學 2013 Establishment and analysis of tapping mode atomic force microscopy simulative measurement model affected by external environment vibration Lin, Z.-C.;Chou, M.-H.
國立臺灣科技大學 2013 Investigation of the abrasive removal depth for bowl-shaped structure of sapphire wafer under compensated chemical mechanical polishing Lin, Z.C.;Wang, R.Y.
國立臺灣科技大學 2012 Analysis on the temperature rise produced by plastic deformation heat for nanoscale orthogonal cutting of copper workpiece Lin, Z.-C.;Hsu, Y.-C.;Chen, L.-K.
國立臺灣科技大學 2012 A grey weighting density-based clustering algorithm for LAO wafer defect inspection Huang, M.-L.;Tsai, M.-J.;Chen, C.C.;Lin, S.C.;Lin, Z.C.
國立臺灣科技大學 2012 A calculating method for the fewest cutting passes on sapphire substrate at a certain depth using specific down force energy with an AFM probe Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學 2012 A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads Lin, Z.-C.;Huang, W.-S.;Tsai, J.-S.
國立臺灣科技大學 2012 Analytical study of simulated nanoscale abrasive cutting of sapphire substrate by three dimensional quasi-steady molecular statics Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學 2012 A study of combining molecular statics with heat transfer finite difference method for nanoscale orthogonal cutting of copper Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學 2012 A study of estimating cutting depth for multi-pass nanoscale cutting by using atomic force microscopy Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學 2012 LED English patents analysis using term segmentation and word segmentation system approach Lin, Z.-C.;Lin, W.-H.;Du, C.-H.
國立臺灣科技大學 2012 Analysis on simulation of quasi-steady molecular statics nanocutting model and calculation of temperature rise during orthogonal cutting of single-crystal copper Lin, Z.-C.;Hsu, Y.-C.
南亞技術學院 2011-05 Curve fabrication model analysis of near-field photolithography Lin, Z-C; Yang, C-B
國立臺灣科技大學 2011 Simulation Analysis and Experiment Study of Nanocutting with AFM Probe on the Surface of Sapphire Substrate by Using Three Dimensional Quasi-steady Molecular Statics Nanocutting Model Lin, Z.C.;Hsu, Y.C.
國立臺灣科技大學 2011 Measurement Simulation of Nanoscale Semicircle Profile by Constant-Amplitude Tapping Mode Atomic Force Microscopy (TM-AFM) and Influence of Probe Shape on Scanning Profile Lin, Z.C.;Huang, J.J.
國立臺灣科技大學 2011 Binary Image Analysis and the Stress Analysis of Wafer of Compensated Chemical Mechanical Polishing (CCMP) Lin, Z.C.;Lee, Y.H.
國立臺灣科技大學 2011 Establishment of a Near-Field Photolithography Processing Experiment Prediction Model and Parameter Optimization Model Lin, Z.C.;Yang, C.B.
國立臺灣科技大學 2011 Curve fabrication model analysis of near-field photolithography Lin, Z.C.;Yang, C.B.
國立臺灣科技大學 2011 Hot-melt-drawn Fabrication Model of Optical Fiber Probes and Analysis Lin, Z.C.;Yang, C.B.;Lee, K.P.
國立臺灣科技大學 2011 Theoretical model for the hot-melt-drawn fabrication of optical fibre probes and the analysis of fabrication parameters Lin, Z.C.;Yang, C.B.;Lee, K.P.
國立臺灣科技大學 2010 Measurement simulation model and qualitative analysis of tapping Mode Atomic Force Microscopy under vibration environment Lin Z.-C.; Chou M.-H.
國立臺灣科技大學 2010 Simulation of nanoscale orthogonal cutting of single-crystal silicon Lin Z.-C.; Peng S.-S.; Wang R.-Y.
國立臺灣科技大學 2010 Nano-scale simulative measuring model for tapping mode atomic force microscopy and analysis for measuring a nano-scale ladder-shape standard sample Lin Z.-C.; Chou M.-H.
國立臺灣科技大學 2010 Distribution of polishing times for a wafer with different patterned polishing pads during CMP and CCMP Lin Z.-C.; Chen C.-C.
國立臺灣科技大學 2010 Combining the Taguchi method with an artificial neural network to construct a prediction model for near-field photolithography experiments Lin Z.-C.; Yang C.-B.
國立臺灣科技大學 2010 Construction and analysis of nanoscale simulative measuring model for scanning near-field optical microscope Lin Z.-C.; Chou M.-H.
國立臺灣科技大學 2010 Three dimensional quasi-steady orthogonal nanocutting model and simulation analysis Lin Z.-C.; Yang J.-M.
國立臺灣科技大學 2010 Evaluation priority of design decision using a modified analytical hierarchy process and a knowledge coding system for a web frame structure Lin Z.-C.; Cheng C.-H.
國立臺灣科技大學 2010 Three Dimensional Nanoscale Abrasive Cutting Simulation and Analysis for Single-Crystal Silicon Workpiece Lin, Z.C.;Wang, R.Y.
南亞技術學院 2010 Combining the Taguchi method with an artificial neural network to construct a prediction model for near-field photolithography experiments Lin, Z-C; Yang, C-B
國立臺灣科技大學 2009-04 Anti-collision algorithm with the aid of interference cancellation and tag set partitioning in radio-frequency identification systems Tseng, D.-F.;Lin, Z.-C.
國立臺灣科技大學 2009 Performance of coated tungsten carbide tools on milling printed circuit board Lin Z.-C.; Ho C.-Y.
國立臺灣科技大學 2009 The determination of material strength coefficient and strain hardening constant by inverse method Lin Z.-C.; Chen C.-C.; Wang H.-H.

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