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Showing items 16-40 of 220 (9 Page(s) Totally)
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Institution	Date	Title	Author
國立臺灣科技大學	2016	Combination of improved cosine similarity and patent attribution probability method to judge the attribution of related patents of hydrolysis substrate fabrication process	Lin, Z.-C;Wu, D.-W;Hong, G.-E.
國立臺灣科技大學	2016	Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory	Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W.
國立臺灣科技大學	2015	Investigation of abrasive removal depth of sapphire wafer for different slurry volume concentrations of chemical mechanical polishing with cross pattern polishing pad	Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學	2015	An innovative method and experiment for fabricating bulgy shape nanochannel using AFM	Lin, Z.-C;Jheng, H.-Y;Ding, H.-Y.
國立臺灣科技大學	2015	Theoretical model of calculating cutting force and down force for nanocutting of V-shaped groove on single-crystal silicon	Lin, Z.-C;Lin, C.-T;Hsu, Y.-C.
國立交通大學	2014-12-08T15:15:56Z	Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy	Lin, S. D.; Lin, Z. C.; Lee, C. P.
國立交通大學	2014-12-08T15:14:39Z	Mobility asymmetry in InGaAs/InAlAs heterostructures with InAs quantum wires	Lin, Z. C.; Hsieh, W. H.; Lee, C. P.; Suen, Y. W.
國立交通大學	2014-12-08T15:12:46Z	Ordering of stacked InAs/GaAs quantum-wires in InAlAs/InGaAs matrix on (100) InP substrates	Lin, Z. C.; Lin, S. D.; Lee, C. P.
國立臺灣科技大學	2014	Abrasive removal depth for polishing a sapphire wafer by a cross-patterned polishing pad with different abrasive particle sizes	Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學	2014	Simulation of temperature field during nanoscale orthogonal cutting of single-crystal silicon by molecular statics method	Lin, Z.-C.;Lin, M.-H.;Hsu, Y.-C.
國立臺灣科技大學	2014	Fabrication method and experiment study of nanoscale trapezoidal groove on sapphire substrate by using atomic force microscope under a fixed cutting depth and changed down force	Lin, Z.-C.;Tsai, J.-S.;Hsu, Y.-C.;Lin, C.-T.
國立臺灣科技大學	2014	A study of simulation of three-dimensional quasi-steady molecular statics nanoscale orthogonal cutting of single-crystal silicon material having rows of atoms with vacancy defect	Lin, Z.-C.;Jian, C.-S.;Wang, R.-Y.
國立臺灣科技大學	2013	Simulation and temperature rise analysis for nanocutting sapphire workpiece with quasi-steady molecular statics method	Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學	2013	Establishment and analysis of tapping mode atomic force microscopy simulative measurement model affected by external environment vibration	Lin, Z.-C.;Chou, M.-H.
國立臺灣科技大學	2013	Investigation of the abrasive removal depth for bowl-shaped structure of sapphire wafer under compensated chemical mechanical polishing	Lin, Z.C.;Wang, R.Y.
國立臺灣科技大學	2012	Analysis on the temperature rise produced by plastic deformation heat for nanoscale orthogonal cutting of copper workpiece	Lin, Z.-C.;Hsu, Y.-C.;Chen, L.-K.
國立臺灣科技大學	2012	A grey weighting density-based clustering algorithm for LAO wafer defect inspection	Huang, M.-L.;Tsai, M.-J.;Chen, C.C.;Lin, S.C.;Lin, Z.C.
國立臺灣科技大學	2012	A calculating method for the fewest cutting passes on sapphire substrate at a certain depth using specific down force energy with an AFM probe	Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學	2012	A study of material removal amount of sapphire wafer in application of chemical mechanical polishing with different polishing pads	Lin, Z.-C.;Huang, W.-S.;Tsai, J.-S.
國立臺灣科技大學	2012	Analytical study of simulated nanoscale abrasive cutting of sapphire substrate by three dimensional quasi-steady molecular statics	Lin, Z.-C.;Wang, R.-Y.
國立臺灣科技大學	2012	A study of combining molecular statics with heat transfer finite difference method for nanoscale orthogonal cutting of copper	Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學	2012	A study of estimating cutting depth for multi-pass nanoscale cutting by using atomic force microscopy	Lin, Z.-C.;Hsu, Y.-C.
國立臺灣科技大學	2012	LED English patents analysis using term segmentation and word segmentation system approach	Lin, Z.-C.;Lin, W.-H.;Du, C.-H.
國立臺灣科技大學	2012	Analysis on simulation of quasi-steady molecular statics nanocutting model and calculation of temperature rise during orthogonal cutting of single-crystal copper	Lin, Z.-C.;Hsu, Y.-C.
南亞技術學院	2011-05	Curve fabrication model analysis of near-field photolithography	Lin, Z-C; Yang, C-B

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