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"lin z c"
Showing items 6-15 of 220 (22 Page(s) Totally)
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| 國立臺灣科技大學 |
2018 |
Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer
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Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H. |
| 國立臺灣科技大學 |
2018 |
Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory
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Lin Z.-C.; Wang R.-Y.; Jhang Z.-W. |
| 國立臺灣科技大學 |
2018 |
Theoretical model and experimental analysis of chemical mechanical polishing with the effect of slurry for abrasive removal depth and surface morphology of silicon wafer
|
Lin, Z.-C.;Wang, R.-Y.;Ma, S.-H. |
| 國立臺灣科技大學 |
2017 |
Investigatory nanoscale thickness of the chemical reaction layer of sapphire substrate for the various dipping temperatures of slurry suitable in CMP
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Lin, Z.-C;Ding, H.-Y;Ma, S.-H. |
| 國立臺灣科技大學 |
2017 |
Fatigue Strength Analysis and Engineering Knowledge Framework of Multi-Layer Support Structure of A Ro/ro ship
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Lin, Z.-C.;Cheng, Cheng C.-H. |
| 國立臺灣科技大學 |
2017 |
A study of patent analysis of LED bicycle light by using modified DEMATEL and life span
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Lin, Z.-C.;Hong, G.-E.;Cheng, P.-F. |
| 國立臺灣科技大學 |
2017 |
Analysis on Patent Categorization of LED Standing/Desk Lamp Patents with Considering the Position Weight
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Lin, Z.-C.;Lin, M.-H.;Hong, G.-E. |
| 國立臺灣科技大學 |
2017 |
Simplified Methodology for Ride Comfort Assessment Based on Wheel/Rail Contact Geometry Synthesis
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Wu, Y.-E.;Chien, M.-H.;Liao, K.-L.;Lin, Z.-C.;Chieng, W.-H. |
| 國立臺灣科技大學 |
2017 |
Experimental analysis on surface profile of sapphire wafer after polishing by chemical mechanical polishing
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Lin, Z.-C.;Huang, W.-S.;Ding, H.-Y. |
| 國立臺灣科技大學 |
2017 |
A study of specific down force energy and cutting depth of sapphire substrate affected by different dipping temperatures of slurry
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Lin Z.-C.; Ding H.-Y.; Chen P.-Y. |
Showing items 6-15 of 220 (22 Page(s) Totally)
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