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Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
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Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
國立交通大學 |
2014-12-08T15:30:49Z |
The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu pads
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Lin, Han-wen; Lu, Jia-ling; Liu, Chen-min; Chen, Chih; Tu, King-ning; Chen, Delphic; Kuo, Jui-Chao |
Showing items 1-2 of 2 (1 Page(s) Totally) 1 View [10|25|50] records per page
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