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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2019-04-03T06:44:31Z Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning
國立交通大學 2014-12-08T15:30:49Z The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu pads Lin, Han-wen; Lu, Jia-ling; Liu, Chen-min; Chen, Chih; Tu, King-ning; Chen, Delphic; Kuo, Jui-Chao

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