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Institution Date Title Author
國立交通大學 2019-04-03T06:43:33Z Effect of grain orientations of Cu seed layers on the growth of < 111 >-oriented nanotwinned Cu Liu, Chien-Min; Lin, Han-Wen; Lu, Chia-Ling; Chen, Chih
國立交通大學 2019-04-03T06:38:02Z Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning
國立交通大學 2019-04-02T05:59:56Z Growth Mechanism of TiO2 Nanotube Arrays in Nanopores of Anodic Aluminum Oxide on Si Substrates by Atomic Layer Deposition Liu, Chien-Min; Chen, Chih; Cheng, Hsyi-En
國立交通大學 2019-04-02T05:59:49Z Ultraviolet Photoresponse of TiO2 Nanotube Arrays Fabricated by Atomic Layer Deposition Liu, Chien-Min; Chen, Chih; Cheng, Hsyi-En
國立交通大學 2019-04-02T05:58:26Z Direct probe of heterojunction effects upon photoconductive properties of TiO2 nanotubes fabricated by atomic layer deposition Chang, Yung-Huang; Liu, Chien-Min; Tseng, Yuan-Chieh; Chen, Chih; Chen, Chia-Chuan; Cheng, Hsyi-En
國立交通大學 2017-04-21T06:49:38Z LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.
國立交通大學 2017-04-21T06:48:31Z Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning
國立交通大學 2017-04-21T06:48:31Z Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N.
國立交通大學 2017-04-21T06:48:21Z Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N.
國立交通大學 2016-03-28T00:04:16Z Formation of plate-like channels in Cu6Sn5 and Cu3Sn intermetallic compounds during transient liquid reaction of Cu/Sn/Cu structures Chiu, Wei-Lan; Liu, Chien-Min; Haung, Yi-Sa; Chen, Chih

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