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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立屏東大學 2021 正向行為支持對改善國小六年級學童課堂行為問題之成效 劉志堯; LIU, CHIH-YAO
國立成功大學 2014-01-05 Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long
國立暨南國際大學 2012 支援雲端運算擴展性分散式檔案系統的叢集式FTP伺服器的設計與實作 劉智堯; Liu, Chih-Yao
國立成功大學 2009-07-23 添加Bi於Sn-Zn-Ag系無鉛銲錫之機械、電性與電化學性質 劉至曜; Liu, Chih-Yao
國立成功大學 2009-07-23 添加Bi於Sn-Zn-Ag系無鉛銲錫之機械、電性與電化學性質 劉至曜; Liu, Chih-Yao
國立成功大學 2008-08-11 Microstructure and adhesion strength of Sn-9Zn-1.5Ag-xBi (x=0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution Li, Wang-Long; Chen, Ying-Ru; Chang, Kuo-Ming; Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin
國立高雄應用科技大學 2008 Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution Li, Wang-Long; Chen, Ying-Ru; Chang, Kuo-Ming; Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin
國立成功大學 2007-11 Electrochemical properties of joints formed between Sn-9Zn-1.5Ag-1 Bi alloys and Cu substrates in a 3.5 wt.% NaCl solution Liu, Chih-Yao; Chen, Ying-Ru; Li, Wang-Long; Hon, Min-Hsiung
國立成功大學 2007-08 Effect of thermal treatment on the intermetallic compounds formed at Sn-9Zn-1.5Ag-xBi (x=0 and 1) lead-free solder/Cu interface Liu, Chih-Yao; Chen, Ying-Ru; Li, Wang-Long; Hon, Min-Hsiung; Wang, Moo-Chin
國立成功大學 2006-05 Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2006-04-15 Thermal behavior and microstructure of the intermetallic compounds formed at the Sn-3Ag-0.5Cu/Cu interface after soldering and isothermal aging Liu, Chih-Yao; Lai, Chien-Hong; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學 2004-12 Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung

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