|
English
|
正體中文
|
简体中文
|
Total items :2823024
|
|
Visitors :
30284433
Online Users :
2016
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"liu chih yao"
Showing items 1-12 of 12 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立屏東大學 |
2021 |
正向行為支持對改善國小六年級學童課堂行為問題之成效
|
劉志堯; LIU, CHIH-YAO |
| 國立成功大學 |
2014-01-05 |
Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys
|
Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long |
| 國立暨南國際大學 |
2012 |
支援雲端運算擴展性分散式檔案系統的叢集式FTP伺服器的設計與實作
|
劉智堯; Liu, Chih-Yao |
| 國立成功大學 |
2009-07-23 |
添加Bi於Sn-Zn-Ag系無鉛銲錫之機械、電性與電化學性質
|
劉至曜; Liu, Chih-Yao |
| 國立成功大學 |
2009-07-23 |
添加Bi於Sn-Zn-Ag系無鉛銲錫之機械、電性與電化學性質
|
劉至曜; Liu, Chih-Yao |
| 國立成功大學 |
2008-08-11 |
Microstructure and adhesion strength of Sn-9Zn-1.5Ag-xBi (x=0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution
|
Li, Wang-Long; Chen, Ying-Ru; Chang, Kuo-Ming; Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立高雄應用科技大學 |
2008 |
Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution
|
Li, Wang-Long; Chen, Ying-Ru; Chang, Kuo-Ming; Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2007-11 |
Electrochemical properties of joints formed between Sn-9Zn-1.5Ag-1 Bi alloys and Cu substrates in a 3.5 wt.% NaCl solution
|
Liu, Chih-Yao; Chen, Ying-Ru; Li, Wang-Long; Hon, Min-Hsiung |
| 國立成功大學 |
2007-08 |
Effect of thermal treatment on the intermetallic compounds formed at Sn-9Zn-1.5Ag-xBi (x=0 and 1) lead-free solder/Cu interface
|
Liu, Chih-Yao; Chen, Ying-Ru; Li, Wang-Long; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2006-05 |
Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging
|
Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2006-04-15 |
Thermal behavior and microstructure of the intermetallic compounds formed at the Sn-3Ag-0.5Cu/Cu interface after soldering and isothermal aging
|
Liu, Chih-Yao; Lai, Chien-Hong; Wang, Moo-Chin; Hon, Min-Hsiung |
| 國立成功大學 |
2004-12 |
Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate
|
Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung |
Showing items 1-12 of 12 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
