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"liu chih yao"的相关文件
显示项目 1-10 / 12 (共2页)
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| 國立屏東大學 |
2021 |
正向行為支持對改善國小六年級學童課堂行為問題之成效
|
劉志堯; LIU, CHIH-YAO |
| 國立成功大學 |
2014-01-05 |
Effects of aging time on the mechanical properties of Sn-9Zn-1.5Ag-xBi lead-free solder alloys
|
Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin; Chen, Ying-Ru; Chang, Kuo-Ming; Li, Wang-Long |
| 國立暨南國際大學 |
2012 |
支援雲端運算擴展性分散式檔案系統的叢集式FTP伺服器的設計與實作
|
劉智堯; Liu, Chih-Yao |
| 國立成功大學 |
2009-07-23 |
添加Bi於Sn-Zn-Ag系無鉛銲錫之機械、電性與電化學性質
|
劉至曜; Liu, Chih-Yao |
| 國立成功大學 |
2009-07-23 |
添加Bi於Sn-Zn-Ag系無鉛銲錫之機械、電性與電化學性質
|
劉至曜; Liu, Chih-Yao |
| 國立成功大學 |
2008-08-11 |
Microstructure and adhesion strength of Sn-9Zn-1.5Ag-xBi (x=0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution
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Li, Wang-Long; Chen, Ying-Ru; Chang, Kuo-Ming; Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立高雄應用科技大學 |
2008 |
Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution
|
Li, Wang-Long; Chen, Ying-Ru; Chang, Kuo-Ming; Liu, Chih-Yao; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2007-11 |
Electrochemical properties of joints formed between Sn-9Zn-1.5Ag-1 Bi alloys and Cu substrates in a 3.5 wt.% NaCl solution
|
Liu, Chih-Yao; Chen, Ying-Ru; Li, Wang-Long; Hon, Min-Hsiung |
| 國立成功大學 |
2007-08 |
Effect of thermal treatment on the intermetallic compounds formed at Sn-9Zn-1.5Ag-xBi (x=0 and 1) lead-free solder/Cu interface
|
Liu, Chih-Yao; Chen, Ying-Ru; Li, Wang-Long; Hon, Min-Hsiung; Wang, Moo-Chin |
| 國立成功大學 |
2006-05 |
Reliability of adhesion strength of the Sn-9Zn-1.5Ag-0.5Bi/Cu during isothermal aging
|
Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung |
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