臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2006-04-15	Thermal behavior and microstructure of the intermetallic compounds formed at the Sn-3Ag-0.5Cu/Cu interface after soldering and isothermal aging	Liu, Chih-Yao; Lai, Chien-Hong; Wang, Moo-Chin; Hon, Min-Hsiung
國立成功大學	2004-12	Intermetallic compounds and adhesion strength between the Sn-9Zn-1.5Ag-0.5Bi lead-free solder and unfluxed Cu substrate	Liu, Chih-Yao; Wang, Moo-Chin; Hon, Min-Hsiung

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