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Showing items 11-35 of 75  (3 Page(s) Totally)
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Institution Date Title Author
國立臺灣海洋大學 2017-04 Identification of low-molecular-weight vitellogenin 1 (Vg1)-like proteins as nucleotide excision repair (NER) factors in developing zebrafish (Danio rerio) using a transcription-based DNA repair assay. Shen YC; Hsu T; Ling LB; You WC; Liu CW
國家衛生研究院 2015-08 Effects of high-dose phytoestrogens on circulating cellular microparticles and coagulation function in postmenopausal women Cheng, WC;Lo, SC;Tsai, KS;Tu, ST;Wu, JS;Chang, CI;Chen, CL;Shaw, NS;Peng, HY;Wang, SY;Wu, CH;Jan, IS;Hsu, SC;Liu, CW;Lee, LN;Tai, TY
臺北醫學大學 2015 大腸鏡磁控系統 Lien, GS;Liu, CW;Jiang, JA;Chuang, CL
國立交通大學 2014-12-08T15:43:56Z Characteristics of YBa2Cu3O7 thin films deposited on substrates buffered by various TiO2 layers Lin, PL; Liu, CW; Hsieh, CC; Wu, KH; Juang, JY; Uen, TM; Lin, JY; Gou, YS
國立交通大學 2014-12-08T15:43:16Z Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application Cheng, YL; Wang, YL; Liu, CW; Wu, YL; Lo, KY; Liu, CP; Lan, JK
國立交通大學 2014-12-08T15:43:16Z Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process Lan, JK; Wang, YL; Lo, KY; Liu, CP; Liu, CW; Wang, JK; Cheng, YL; Chau, CG
國立交通大學 2014-12-08T15:41:43Z Active devices under CMOS I/O pads Chou, KY; Chen, MJ; Liu, CW
國立交通大學 2014-12-08T15:40:27Z Mechanisms of circular defects for shallow trench isolation oxide deposition Lan, JK; Wang, YL; Liu, CP; Chao, CG; Ay, CY; Liu, CW; Cheng, YL
國立交通大學 2014-12-08T15:39:44Z Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization Cheng, YL; Wang, YL; Liu, CP; Wu, YL; Lo, KY; Liu, CW; Lan, JK; Ay, C; Feng, MS
國立交通大學 2014-12-08T15:39:43Z Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect Chen, KW; Wang, YL; Liu, CP; Yang, K; Chang, L; Lo, KY; Liu, CW
國立交通大學 2014-12-08T15:39:43Z Copper surface protection with a completely enclosed copper structure for a damascene process Wang, TC; Hsieh, TE; Wang, YL; Wu, YL; Lo, KY; Liu, CW; Chen, KW
國立交通大學 2014-12-08T15:39:43Z Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material Cheng, YL; Wang, YL; Wu, YL; Liu, CP; Liu, CW; Lan, JK; O'Neil, ML; Ay, C; Feng, MS
國立交通大學 2014-12-08T15:26:47Z Novel strategies of FSG-CMP for within-wafer uniformity improvement and wafer edge yield enhancement beyond 0.18 micro technologies Chen, KW; Wang, YL; Chang, L; Liu, CW; Lin, YK; Wang, TC; Chang, ST; Lo, KY
國立交通大學 2014-12-08T15:25:52Z Novel programmable digital signal processor for multimedia applications Lin, LC; Lin, TJ; Lee, CC; Chao, CM; Chen, SK; Liu, CH; Hsiao, PC; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:25:52Z Complexity-aware design of DA-based fir filters Chen, CC; Lin, TJ; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:25:38Z Lightweight arithmetic units for VLSI digital signal processors Ou, SH; Lin, TJ; Lin, HY; Chao, CM; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:25:38Z A novel register organization for VLIW digital signal processors Lin, TJ; Lee, CC; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:25:37Z Architecture for area-efficient 2-D transform in H.264/AVC Kuo, YT; Lin, TY; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:25:25Z A dynamic normalization technique for decoding LDPC codes Liao, YC; Lin, CC; Liu, CW; Chang, HC
國立交通大學 2014-12-08T15:25:24Z Hierarchical instruction encoding for VLIW digital signal processors Liu, CH; Lin, TJ; Chao, CM; Hsiao, PC; Lin, LC; Chen, SK; Huang, CW; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:25:23Z Pipelining technique for energy-aware datapaths Huang, WS; Lin, TJ; Ou, SH; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:17:31Z A compact DSP core with static floating-point arithmetic Lin, TJ; Lin, HY; Chao, CM; Liu, CW; Jen, CW
國立交通大學 2014-12-08T15:03:11Z CHARACTERIZATION OF THE CHEMICAL-MECHANICAL POLISHING PROCESS-BASED ON NANOINDENTATION MEASUREMENT OF DIELECTRIC FILMS LIU, CW; DAI, BT; YEH, CF
國立交通大學 2014-12-08T15:03:02Z Chemical mechanical polishing of PSG and BPSG dielectric films: The effect of phosphorus and boron concentration Liu, CW; Dai, BT; Yeh, CF
國立交通大學 2014-12-08T15:02:52Z Modeling of the wear mechanism during chemical-mechanical polishing Liu, CW; Dai, BT; Tseng, WT; Yeh, CF

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