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"liu kuo chio"的相关文件
显示项目 1-3 / 3 (共1页)
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| 國立交通大學 |
2017-04-21T06:56:30Z |
Microstructural Evolution of Cu/Solder/Cu Pillar-Type Structures with Different Diffusion Barriers
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Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
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Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
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Effect of polyimide baking on bump resistance in flip-chip solder joints
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显示项目 1-3 / 3 (共1页)
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