國立成功大學 |
2020 |
Improving the applicability of wear-resistant Al–10Si–0.5 Mg alloy obtained through selective laser melting with T6 treatment in high-temperature, and high-wear environments
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Chen, K.-J.;Hung, F.-Y.;Lui, T.-S.;Tsai, C.-L. |
國立成功大學 |
2020 |
Microstructure and tensile fracture behavior of three-stage heat treated inconel 718 alloy produced via laser powder bed fusion process
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Zhao, J.-R.;Hung, F.-Y.;Lui, T.-S. |
國立成功大學 |
2019 |
Study of electrical fatigue test in gold-coated siliver-4 wt.% palladium bonding wire
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Ho, C.-C.;Chen, K.-J.;Hung, F.-Y.;Lui, T.-S. |
國立成功大學 |
2019 |
Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation
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Wu, Y.-H.;Hung, F.-Y.;Lui, T.-S.;Chen, K.-J. |
國立成功大學 |
2018 |
Microstructure evolution and microstructural characteristics of Al–Mg–Si aluminum alloys fabricated by a modified strain-induced melting activation process
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Lin, C.-W.;Hung, F.-Y.;Lui, T.-S. |
國立成功大學 |
2018 |
Effects of static heat and dynamic current on Al/Zn�Cu/Sn Solder/Ag interfaces of Sn photovoltaic Al-ribbon modules
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Chen, K.-J.;Hung, F.-Y.;Lui, T.-S.;Lin, W.-Y. |
國立成功大學 |
2018 |
Enhancement of the young’s modulus through infrared heat treatment: A study of the microstructure and the mass effect of real body 6082 aluminum forgings
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Chang, Y.-L.;Hung, F.-Y.;Lui, T.-S. |
國立成功大學 |
2017 |
Aluminium wires have the free air balls (FABs): Electronic flame-off, fracture strength, electrical properties, and bonding characteristics of Nano Zn Film Al–Si bonding wires
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Hung, F.-Y.;Lui, T.-S.;Chu, K.-M.;Tseng, Y.-W. |
國立成功大學 |
2015-03 |
Electrochemical performance of Ag doped Al0.6Si0.4/Al thin film anodes
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Wu, C. -H.; Hung, F. -Y.; Lui, T. -S.; Chen, L. -H. |
國立臺灣師範大學 |
2014-10-30T09:36:01Z |
Effect of heating temperature and magnesium content on the thermal cyclic failure behaviour of ductile irons
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Cheng, C. P.; Lui, T. S.; Chen, L. H. |
國立成功大學 |
2012-06 |
Particle erosion of die cast Al-14Si alloy and influence of friction stir process
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Cheng, T. W.; Chen, L. H.; Lui, T. S. |
國立成功大學 |
2012-03 |
Characteristics of Thin-Film-Transistors Based on Zn-In-Sn-O Thin Films Prepared by Co-Sputtering System
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Chen, K. J.; Hung, F. Y.; Lui, T. S.; Chang, S. J.; Liao, T. Y. |
國立成功大學 |
2012 |
The Low-Temperature Crystallization and Interface Characteristics of ZnInSnO/In Films Using a Bias-Crystallization Mechanism
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Chen, K. J.; Hung, F. Y.; Lui, T. S.; Chang, S. J.; Hu, Z. S. |
國立成功大學 |
2007-11 |
In vitro and in vivo biological responses of plasma-sprayed hydroxyapatite coatings with posthydrothermal treatment
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Yang, Chyun-Yu; Lee, Tse-Min; Yang, C. W.; Chen, L. R.; Wu, M. C.; Lui, T. S. |
國立東華大學 |
2006 |
Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders
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Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L. |
國立東華大學 |
2006 |
The Influence of Al Content and Annealing on Vibration Fracture Properties of Wrought Mg-Al-Zn Alloys
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Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,H. W. |
國立東華大學 |
2005-04 |
A Study on Vibration Induced Deformation Structure of Sn-based Pb-free Solders
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Song,J. M.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2005 |
Compositional Effects on the Microstructure and Vibration Fracture Properties of Sn-Zn-Bi alloys
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Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L. |
國立東華大學 |
2005 |
Tin Whiskers of Bulk Solders Generated under Resonance
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Song,J. M.; Lui,T. S.; Chen,L. H.; Chang,Y. L. |
國立東華大學 |
2005 |
Effect of Zn Content on the Vibration Fracture Behavior of Sn-Zn and Sn-Zn-Bi Solders
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Song,J. M.; Lui,T. S.; Chang,Y. L.; Chen,L. H. |
國立東華大學 |
2004 |
Effect of Microstructural Refinement on Tensile Behavior of the AC9A Aluminum Alloy Suffering Thermal Shock Fatigue
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Song,J. M.; Lui,T. S.; Lin,H. M.; Chen,L. H.; Kao,I. H. |
國立東華大學 |
2004 |
Vibration Behavior of a Precipitation-hardening Aluminum Alloy under Resonance
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Song, J. M.; Lui,T. S.; Chen,T. F.; Chen,L. H.; Horng,J. H. |
國立東華大學 |
2004 |
Microstructural Characteristics and Vibration Fracture Behavior of Sn-Zn-Ag Solder Alloys
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Song, J. M.; Lui,T. S.; Chen,L. H.; Lan,G. F. |
國立東華大學 |
2004 |
Investigation of Vibration Fracture Behavior of Sn-Ag-Cu Solders under Resonance
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Song,J. M.; Li,F. I.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2004 |
Effects of Matrix Structure on the Resonant Vibration Behaviors of Spheroid Graphite Cast Iron
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Song,J. M.; Lin,S. C.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2004 |
Vibration Fracture Behavior of Sn-Bi Solder Alloys with Various Bi Contents
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Song,J. M.; Chang,Y. L.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2004 |
Resonant Vibration Behavior of an Al-3.8Cu-0.8Li-0.3Mg Alloy
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Song, J. M.; Tan,B. H.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2004 |
Behavior of Eutectic Sn-Zn, Sn-Ag and Sn-Pb Solders under High Current Stressing Conditions
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Song,J. M.; Tsai,T. Y.; Chen,L. H.; Lui ,T. S. |
國立東華大學 |
2003-03 |
Effects of Copper Content on Vibration Fracture Behavior of Sn-Ag-Cu Solders
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Song,J. M.; Lui,T. S.; Chen,L. H.; Li,F. I. |
國立東華大學 |
2003 |
Resonant Vibration Behavior of Lead-free Solders
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Song,J. M.; Lui,T. S.; Tsai,D. Y.; Chen,L. H. |
國立東華大學 |
2003 |
Study on the Vibration Fracture Resistance of Ferritic Spheroidal Graphite Cast Iron suffer from Aqueous Ambient Environments
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Song, J. M.; Song,Y. H.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2003 |
Examination on the Growth Textures of Eutectic Cementite of Various Morphologies
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Song,J. M.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2003 |
Microstructure and Tensile Properties of Sn-Zn-Ag Lead Free Solder Alloys
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Song,J. M.; Lan,G. F.; Chen,L. H.; Lui,T. S. |
國立東華大學 |
2003 |
Resonant Vibration Behavior of Lead-free Solders
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Song,J. M.; Lui,T. S.; Tsai,D. Y.; Chen,L. H. |
國立成功大學 |
1998-04 |
Erosion of Al-Si alloys by molding silica sand
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Liou, J. W.; Chen, L. H.; Lui, T. S. |