| 國立成功大學 |
2011-01 |
Effect of Zinc Content on Microstructural Evolution and Electrification-Fusion-Induced Failure Mechanism of Sn-xZn Alloys
|
Lan, Gong-An; Yang, Chung-Wei; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2011-01 |
Embrittlement Mechanism on Tensile Fracture of 7075 Al Alloy with Friction Stir Process (FSP)
|
Ku, Ming-Hsiang; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2011-01 |
A study on the tensile fracture mechanism of 15 mu m copper wire after EFO process
|
Huang, I-Ting; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Hsueh, Hao-Wen |
| 國立成功大學 |
2011-01 |
An investigation into the crystallization and electric flame-off characteristics of 20 mu m copper wires
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Hsueh, Hao-Wen |
| 國立成功大學 |
2011 |
Effects of Ordered Texture Surface with Nanometric Scale Roughness on Biological Responses for Titanium Implants
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Lui, Truan-Sheng; Lee, Tzer-Min; Kung, Kuan-Chen |
| 國立成功大學 |
2011 |
The bias-crystallization mechanism on structural characteristics and electrical properties of Zn-In-Sn-O film
|
Chen, Kuan-Jen;Hung, Fei-Yi;Lui, Truan-Sheng;Chang, Shoou-Jinn;Hu, Zhan-Shuo |
| 國立成功大學 |
2009-12 |
Tensile mechanical properties and failure behaviors with the ductile-to-brittle transition of the alpha plus beta-type Mg-Li-Al-Zn alloy
|
Yang, Chung-Wei; Lui, Truan-Sheng; Chen, Li-Hui; Hung, Hau-En |
| 國立成功大學 |
2009-09 |
Kinetics of hydrothermal crystallization under saturated steam pressure and the self-healing effect by nanocrystallite for hydroxyapatite coatings
|
Yang, Chung-Wei; Lui, Truan-Sheng |
| 國立成功大學 |
2009-08 |
Effect of Revolutionary Pitch on the Microhardness Drop and Tensile Properties of Friction Stir Processed 1050 Aluminum Alloy
|
Chen, Ssu-Ta; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2009-07-01 |
Hydrothermal crystallization effect on the improvement of erosion resistance and reliability of plasma-sprayed hydroxyapatite coatings
|
Yang, Chung-Wei; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2009-05-05 |
Studies on the improvement of tensile ductility of hot-extrusion AZ31 alloy by subsequent friction stir process
|
Lee, Hsin-Wei; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2009-05-05 |
The Weibull statistical analysis for evaluating microstructural effects on electrification-fusion phenomenon of Sn-xZn alloys
|
Lan, Gong-An; Yang, Chung-Wei; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2009-02-20 |
Vibration fracture resistance of 5052H112 aluminum alloy processed by cold rolling and friction stirring
|
Huang, Kuo-Tsung; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2009-02 |
Microstructural Characteristics and the Charge-Discharge Characteristics of Sn-Cu Thin Film Materials
|
Wu, Chao-Han; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
2009-02 |
Electric Flame-Off Characteristics and Fracture Properties of 20 mu m Thin Copper Bonding Wire
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Lin, Yi-Chang |
| 國立成功大學 |
2009-01 |
Weibull Statistics for Evaluating Failure Behaviors and Joining Reliability of Friction Stir Spot Welded 5052 Aluminum Alloy
|
Yang, Chung-Wei; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Juo, Jiun-Yu |
| 國立成功大學 |
2008-11 |
Mechanical Properties and Resonant Characteristics of Friction Stirred AZ31-Mg Alloy
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Zhuang, Kai-Jie |
| 國立成功大學 |
2008-10 |
The Recrystallization of Microelectronic Lead-Free Solders
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Gu, Zhi-Feng |
| 國立成功大學 |
2008-07 |
Microstructures and fusing electrical current of microelectronic Sn-9Zn-(0.25RE) solders
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Lan, Kung-An |
| 國立成功大學 |
2008-07 |
Influence of Ga addition on microstructure, tensile properties and surface oxide film characteristics of microelectronic Sn-9Zn-xGa solders
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Ping-Hui |
| 國立成功大學 |
2008-06-12 |
Resonant characteristics of the microelectronic Sn-Cu solder
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; He, Nien-Ting |
| 國立成功大學 |
2008-03 |
Electromagnetic interference shielding characteristics of Sn-Al powder coating layers
|
Hung, Fei-Shuo; Hung, Fei-Yi; Chiang, Che-Ming; Lui, Truan-Sheng |
| 國立成功大學 |
2008-02 |
Influence of austenization temperature on the erosion behavior of austempered ductile irons
|
Chang, L. C.; Hsui, I. C.; Chen, Li-Hui; Lui, Truan-Sheng |
| 國立成功大學 |
2008 |
Microstructural self-healing effect of hydrothermal crystallization on bonding strength and failure mechanism of hydroxyapatite coatings
|
Yang, Chung-Wei; Lui, Truan-Sheng |
| 國立成功大學 |
2007-11 |
Deformation fracture characteristics of microelectronic Sn-3.0Ag-0.5Cu-xNi solders
|
Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chan, Cheng-Wei |
