| 臺大學術典藏 |
2021-05-24T03:41:49Z |
Pulmonary endarterectomy for chronic thromboembolic pulmonary hypertension-A single-center experience in Taiwan
|
Luo W.-C.; Huang S.-C.; Lin Y.-H.; Lai H.-S.; Kuo S.-W.; Pan S.-C.; HSAO-HSUN HSU |
| 臺大學術典藏 |
2020-12-18T05:20:47Z |
Pulmonary endarterectomy for chronic thromboembolic pulmonary hypertension-A single-center experience in Taiwan
|
Luo W.-C.; Huang S.-C.; YEN-HUNG LIN; Lai H.-S.; Kuo S.-W.; Pan S.-C.; Hsu H.-H. |
| 臺大學術典藏 |
2020-09-30T02:30:12Z |
Pulmonary endarterectomy for chronic thromboembolic pulmonary hypertension-A single-center experience in Taiwan
|
Hsu H.-H.; SUNG-CHING PAN; Kuo S.-W.; Lai H.-S.; Lin Y.-H.; Huang S.-C.; Luo W.-C. |
| 臺大學術典藏 |
2020-05-18T08:38:56Z |
Pulmonary endarterectomy for chronic thromboembolic pulmonary hypertension-A single-center experience in Taiwan
|
Luo W.-C.;Huang S.-C.;Lin Y.-H.;Lai H.-S.;Shuenn-Wen Kuo;Pan S.-C.;Hsu H.-H.; Luo W.-C.; Huang S.-C.; Lin Y.-H.; Lai H.-S.; SHUENN-WEN KUO; Pan S.-C.; Hsu H.-H. |
| 臺大學術典藏 |
2020-02-24T05:13:03Z |
Pulmonary endarterectomy for chronic thromboembolic pulmonary hypertension-A single-center experience in Taiwan
|
Luo W.-C.; Huang S.-C.; Lin Y.-H.; HONG-SHIEE LAI; Kuo S.-W.; Pan S.-C.; Hsu H.-H. |
| 臺大學術典藏 |
2019-11-27T02:03:07Z |
Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish
|
C. ROBERT KAO;Kao C.R.;Luo W.-C.; Luo W.-C.; Kao C.R.; C. ROBERT KAO |
| 國立交通大學 |
2017-04-21T06:49:36Z |
PD-SOI MOSFET Body-to-Body Leakage Scaling Trend and Optimization
|
Lo, H. C.; Luo, W. C.; Lu, W. Y.; Cheng, C. F.; Wu, Benny; Chen, T. L.; Lien, C. H.; Fung, Samuel K. H.; Tuan, H. C. |
| 臺大學術典藏 |
2015 |
Pulmonary endarterectomy for chronic thromboembolic pulmonary hypertension-A single-center experience in Taiwan
|
Hsu H.-H.; Pan S.-C.; Kuo S.-W.; Lai H.-S.; Lin Y.-H.; SHU-CHIEN HUANG; Luo W.-C. |
| 國立交通大學 |
2014-12-08T15:10:19Z |
The Characteristics and Control of Body-to-Body Leakage Current in PD-SOI
|
Lo, H. C.; Luo, W. C.; Lu, W. Y.; Cheng, C. F.; Chen, T. L.; Lien, C. H.; Fung, S. K. H.; Wu, C. C. |
| 國立臺灣大學 |
2005-04 |
Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations
|
Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2004-12 |
Cross-interaction of UBM and soldering pad in flip-chip solder joints
|
Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R. |
| 國立臺灣大學 |
2004-10 |
Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints
|
Lin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, and C. R. |
| 淡江大學 |
1989 |
Solvatochromism and conducting TCNQ salts of M-hydroxy-M(N-methyl) stilbazolium betaine isomers
|
余良杰; Yu, L. J.; Luo, W. C. |
