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Showing items 1-6 of 6 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-03T06:38:02Z |
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
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Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-12T02:38:30Z |
三維積體電路關鍵技術 於先進背照式感光元件應用之研究
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呂典融; Lyu, Dian-Rong; 陳冠能; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:36:21Z |
A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
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Ko, Cheng-Ta; Hsiao, Zhi-Cheng; Chang, Hsiang-Hung; Lyu, Dian-Rong; Hsu, Chao-Kai; Fu, Huan-Chun; Chien, Chun-Hsien; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
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Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
Showing items 1-6 of 6 (1 Page(s) Totally)
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