臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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"m h r jen"

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Institution	Date	Title	Author
國立中山大學	2009	Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints	M.H. R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints	M.H.R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2006	Thermo-Mechanical Fatigue of Centrally Notched and Unnotched AS-4/PEEK APC-2 Composite Laminates	M.H.R. Jen; Y.C. Tseng; W.H. Lin
國立中山大學	2006	Mechanical Properties in Notched AS-4/PEEK APC-2 Composite Laminates at Elevated Temperature	M.H.R. Jen; Y.C. Tseng; S.C. Chang; M. Chen
國立中山大學	2006	Mechanical Properties in Notched AS-4/PEEK APC-2 Composite Laminates at Elevated Temperature	M.H.R. Jen;Y.C. Tseng;S.C. Chang;M. Chen
國立中山大學	2005-05	Thermal-Mechanical Fatigue Response in Nanocomposite APC-2 Laminates	M.H.R. Jen; Y.C. Tseng; Y.H. Huang; J.C.C. Huang
國立中山大學	2005	Manufacturing and Mechanical Response of Nanocomposite Laminates	M.H.R. Jen; Y.C. Tseng; C.H. Wu
國立中山大學	2005	Flip-Chip Ball Grid Array Lead-Free Solder Joint under Reliability Test	M.H.R. Jen; L.C. Liu; J.D. Wu
國立中山大學	2004-05-27	Manufacturing and Mechanical Response of Nanocomposite Laminates	M.H.R. Jen; Y.C. Tseng; C.H. Wu
國立中山大學	2004	An Innovative Fatigue Method inSingle-Lapped Mixed Composite Joints	W.H. Lin; C.H. Lin; M.H.R. Jen

Showing items 1-10 of 60 (6 Page(s) Totally)
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