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Institution Date Title Author
國立中山大學 2009 In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays A.T. Wu;C.Y. Tsai;C.L. Kao;M.K. Shih;Y.S. Lai;H.Y. Lee;C.S. Ku
國立中山大學 2009 Design optimization of needle geometry for wafer-level probing test M.K. Shih;Y.S. Lai
國立中山大學 2009 Ultra-long probing needle design for digital light processing wafer testing H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學 2009 Underfill study for large dice flip chip packages A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學 2009 Ultra-long probing needle design for digital light processing wafer testing H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學 2009 Experimental investigation and finite element analysis of bump wafer probing H.Y. Chang;W.F. Pan;M.K. Shih;Y.S. Lai
國立高雄師範大學 2003 Assessment of genotoxicity of benzidine and its structural analogues to human lymphocytes using comet assay 陳師慶;陳亞雷; Ssu-Ching Chen;C. M. Kao; M. H. Huang; M. K. Shih;Y. L. Chen;S. P. Huang; T. Z. Liu
國立高雄師範大學 2001 Inhibition of UVA-enhanced DNA damage from Fenton reaction by gallic acid 陳師慶;陳亞雷; Ya-Lei Chen;Ssu-Ching Chen;J. C. Wu;M. K. Shih

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