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Institution Date Title Author
國立成功大學 2018-03 On the formation mechanism of solid-solution Cu-to-Cu joints in the Cu/Ni/Ga/Ni/Cu system Lin;Shih-kang;Yeh;Che-yu;Wang;Mei-jun
國立成功大學 2017-04-25 High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy Lin;Shih-kang;Wang;Mei-jun;Yeh;Che-yu;Chang;Hao-miao;Liu;Yu-chen

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