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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
義守大學 2018-04 Characteristics of a Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications I-Chih Wu;Yu-Jung Huang;Min-Haw Wang;Ling-Sheng Jang
南台科技大學 2007-01 A Microfluidic Device for Capture of Single Cells and Impedance Measurement 許藝菊; Min-Haw Wang; Min-Feng Kao; Haw-Juin Liu; Wai-Hong Kan; Yi-Chu Hsu; Ling-Sheng Jang

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