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Showing items 1-10 of 142 (15 Page(s) Totally)
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| 臺大學術典藏 |
2021-04-21T23:30:13Z |
Electrically programmable magnetoresistance in AlO x -based magnetic tunnel junctions
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Hong, Jhen Yong; Hung, Chen Feng; Yang, Kui Hon Ou; Chiu, Kuan Chia; Ling, Dah Chin; Chiang, Wen Chung; MINN-TSONG LIN |
| 臺大學術典藏 |
2021-03-03T05:34:06Z |
Tunable magnetic circular dichroism via electrochemically controlled charge-transfer transition in Ru(bpy)32 + aqueous solution
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Pan, Hai Ping; Huang, Ya Huei; Hsu, Hua Shu; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:08Z |
Influence of in situ applied stress during thermal oxidation of (111)Si on P-b interface defects
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Stesmans, A.;Pierreux, D.;Jaccodine, R. J.;Lin, M. T.;Delph, T. J.; Stesmans, A.; Pierreux, D.; Jaccodine, R. J.; Lin, M. T.; Delph, T. J.; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:08Z |
Enhancement of semiconductor equipment communications using a web-enabled equipment driver
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Cheng, F. T.;Lin, M. T.; Cheng, F. T.; Lin, M. T.; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:08Z |
Cloning and characterization of a cDNA for 1-aminocyclopropane-1-carboxylate oxidase from papaya fruit
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Lin, C. T.;Lin, M. T.;Shaw, J. F.; Lin, C. T.; Lin, M. T.; Shaw, J. F.; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:08Z |
Measurement of Polarization Parameter in Np Charge-Exchange Scattering from 2 to 12 Gev-C
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MINN-TSONG LIN; Abolins, Ma; Lin, Mt; Ruchti, Rc; Horowitz, Jg; Kammerud, Rc; Reay, Nw; Reibel, K.; Stanton, Nr; Edwards, Kw; Crabb, Dg; Ofallon, Jr |
| 臺大學術典藏 |
2019-12-27T07:50:07Z |
Vortex domain wall depinning by polarized current in submicron half-ring wires
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Chen, Y. S.;Cheng, K. W.;Yu, C.;Lee, S. F.;Chen, D. C.;Wu, S. H.;Lin, M. T.;Liou, Y.;Wu, K. T.;Yao, Y. D.; Chen, Y. S.; Cheng, K. W.; Yu, C.; Lee, S. F.; Chen, D. C.; Wu, S. H.; Lin, M. T.; Liou, Y.; Wu, K. T.; Yao, Y. D.; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:07Z |
Interpretation of temperature control for ternary distillation
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Lin, M. T.; Yu, C. C.; Luyben, M. L.; Lin, M. T.; Yu, C. C.; Luyben, M. L.; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:07Z |
High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging
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Lin, C. J.;Lin, M. T.;Wu, S. P.;Tseng, F. G.; Lin, C. J.; Lin, M. T.; Wu, S. P.; Tseng, F. G.; MINN-TSONG LIN |
| 臺大學術典藏 |
2019-12-27T07:50:07Z |
Electron spin resonance study of the effect of applied stress during thermal oxidation of (111)Si on inherent Pb interface defects
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Pierreux, D.;Stesmans, A.;Jaccodine, R. J.;Lin, M. T.;Delph, T. J.; Pierreux, D.; Stesmans, A.; Jaccodine, R. J.; Lin, M. T.; Delph, T. J.; MINN-TSONG LIN |
Showing items 1-10 of 142 (15 Page(s) Totally)
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