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Showing items 1-4 of 4 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立成功大學 |
2013-08 |
Connecting Carbon Nanotubes Using Sn
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Mittal, Jagjiwan; Lin, Kwang Lung |
國立成功大學 |
2012-04 |
Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate
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Mittal, Jagjiwan; Lin, Kwang Lung |
國立成功大學 |
2011-11 |
The formation of electric circuits with carbon nanotubes and copper using tin solder
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Mittal, Jagjiwan; Lin, Kwang Lung |
國立成功大學 |
2009-12 |
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
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Mittal, Jagjiwan; Kuo, Shih-Ming; Lin, Yu-Wei; Lin, Kwang-Lung |
Showing items 1-4 of 4 (1 Page(s) Totally) 1 View [10|25|50] records per page
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